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FNA51560TD2

Onsemi

FNA51560TD2 by Onsemi

FNA51560TD2 by Onsemi is a Motion Control IC with 20 terminals, operating at 14-16.5V. It features a max output current of 15A and technology hybrid design. Ideal for AC motor control applications due to its compact rectangular package style and dual terminal position.

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Digiode

USA . 691 parts In-Stock

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Vyrian

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TANS Electronics

Latvia . 7,879 parts In-Stock

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Problanco Electronics

Mexico . 7,444 parts In-Stock

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SupplyDigital Components

Austria . 6,672 parts In-Stock

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Kulean Microsystems

USA . 5,726 parts In-Stock

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Corphita

USA . 1,001 parts In-Stock

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Northwest PG Solutions

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UHIMA Technologies

Türkiye . 397 parts In-Stock

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Native Components

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Corohmni

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Overview

Experience unparalleled quality and reliability with the FNA51560TD2 motion control IC by Onsemi. As a leading manufacturer in the industry, Onsemi brings you cutting-edge technology for a wide range of applications. From AC motor controllers to precision control systems, this product offers unmatched performance and efficiency. With a nominal supply voltage of 15V and maximum output current of 15A, the FNA51560TD2 delivers exceptional value and benefits to customers looking for top-tier motion control solutions. Upgrade your projects with Onsemi's innovative technology today!

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular package shape ensures compatibility with standard mounting and enclosure designs, making it easier to integrate into existing systems.

Nominal Supply Voltage (Vsup): 15 V

Operating at a nominal supply voltage of 15V provides a good balance between power consumption and performance for the motion control IC.

No. of Terminals: 20

Having 20 terminals allows for a greater level of connectivity and flexibility in wiring configurations for controlling motion systems.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly style offers compact size and efficient thermal management, ideal for applications where space is limited and heat dissipation is critical.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves reliability in connection, ensuring more stable operation of the motion control IC.

Maximum Seated Height: 6 mm

Low maximum seated height allows for more compact system designs and minimizes space requirements, especially in constrained environments.

Width (mm): 21 mm

Narrow width of 21mm makes the motion control IC suitable for applications with limited space availability, enabling easier integration in small form factor devices.

Other IC type: AC MOTOR CONTROLLER

Being an AC motor controller type allows the IC to efficiently and precisely control AC motors, making it a good choice for applications requiring smooth and accurate motion control.

Minimum Supply Voltage (Vsup): 14 V

Having a minimum supply voltage of 14V ensures compatibility with a wide range of power sources and improves the versatility of the motion control IC.

Length: 37 mm

The length of 37mm strikes a good balance between compactness and functionality, making it suitable for various applications without sacrificing performance.

Maximum Supply Current (Isup): 2.5 mA

Low maximum supply current of 2.5mA indicates efficient power usage and helps in reducing energy consumption, making it environmentally friendly and cost-effective.

Maximum Output Current: 15 A

High maximum output current of 15A allows the motion control IC to drive powerful motors and handle demanding applications with ease, providing high performance and reliability.

Technology: HYBRID

Hybrid technology combines the benefits of different technologies to deliver optimized performance, reliability, and efficiency in controlling motion systems.

Terminal Form: THROUGH-HOLE

Through-hole terminal form offers strong mechanical stability and ease of soldering, ensuring secure connections and long-term reliability in demanding environments.

Maximum Supply Voltage (Vsup): 16.5 V

Operating at a maximum supply voltage of 16.5V provides headroom for voltage fluctuations and safeguards against overloading, enhancing the durability and robustness of the motion control IC.

Technical Specifications

Motion Control ICs FNA51560TD2 attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XDMA-T20

Length:

37 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Output Current:

15 A

Package Body Material:

UNSPECIFIED

Package Code:

DMA

Package Equivalence Code:

MODULE,20LEAD,1.0

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

6 mm

Maximum Supply Current (Isup):

2.5 mA

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

14 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

HYBRID

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Width (mm):

21 mm

Trade Compliance

FNA51560TD2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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