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FNA51060TD

Onsemi

FNA51060TD by Onsemi

FNA51060TD by Onsemi is a Motion Control IC with 20 terminals, operating at 14-16.5V. It features a max output current of 30A and technology hybrid design. Ideal for AC motor control applications due to its compact rectangular package style and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,742 parts In-Stock

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Vyrian

USA . 1,162 parts In-Stock

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Problanco Electronics

Mexico . 8,308 parts In-Stock

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SupplyDigital Components

Austria . 7,863 parts In-Stock

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Kulean Microsystems

USA . 3,585 parts In-Stock

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UHIMA Technologies

Türkiye . 672 parts In-Stock

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Northwest PG Solutions

USA . 643 parts In-Stock

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Corphita

USA . 429 parts In-Stock

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Corohmni

South Africa . 236 parts In-Stock

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TANS Electronics

Latvia . 222 parts In-Stock

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Native Components

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Overview

Revolutionize your motion control applications with the FNA51060TD by Onsemi. As a leader in motion control ICs, Onsemi delivers top-notch quality and reliability. This AC motor controller boasts a maximum output current of 30A and a nominal supply voltage of 15V, making it ideal for a wide range of applications. With a compact design and advanced hybrid technology, this product offers exceptional value and performance, ensuring smooth and efficient operation. Upgrade your motion control systems today with the FNA51060TD from Onsemi.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into various circuit layouts and designs.

Nominal Supply Voltage (Vsup): 15 V

Optimal nominal supply voltage ensures efficient performance and compatibility with standard power sources.

No. of Terminals: 20

Sufficient number of terminals for connecting the IC to other components in the circuit, enabling versatile applications.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly provides compact and space-saving design for applications where size constraints are a concern.

Terminal Position: DUAL

Dual terminal position allows for easier and more secure installation on the circuit board, minimizing the risk of loose connections.

Maximum Seated Height: 6 mm

Low seated height facilitates placement in tight spaces and slim enclosures, enhancing overall system design flexibility.

Width (mm): 21 mm

Moderate width dimension enables efficient PCB layout while providing adequate space for other components in the system.

Other IC type: AC MOTOR CONTROLLER

AC motor controller type indicates specialized functionality for controlling AC motors, making it a suitable choice for motor control applications.

Minimum Supply Voltage (Vsup): 14 V

Low minimum supply voltage requirement ensures compatibility with a wide range of power sources and operational stability under varying conditions.

Length: 37 mm

Moderate length dimension for easy installation and placement on the PCB, offering flexibility in system layout and design.

Maximum Supply Current (Isup): 2.5 mA

Low maximum supply current helps in reducing power consumption and heat dissipation, contributing to energy-efficient operation.

Maximum Output Current: 30 A

High maximum output current capability allows for driving high-power loads, making it suitable for applications requiring robust motor control.

Technology: HYBRID

Hybrid technology combines the advantages of different circuit technologies, offering a balance between performance, efficiency, and cost-effectiveness.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure mechanical connections and facilitates easy soldering during the assembly process.

Maximum Supply Voltage (Vsup): 16.5 V

High maximum supply voltage rating ensures compatibility with a wide range of power sources and allows for safe operation under varying voltage conditions.

Technical Specifications

Motion Control ICs FNA51060TD attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XDMA-T20

Length:

37 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Output Current:

30 A

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

6 mm

Maximum Supply Current (Isup):

2.5 mA

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

14 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

HYBRID

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Width (mm):

21 mm

Trade Compliance

FNA51060TD Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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