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TMC603A-LA

Microchip Technology

TMC603A-LA by Microchip Technology

TMC603A-LA by Microchip Technology is a motion control IC with 1 function. It operates at a nominal voltage of 5V and has a max operating temperature of 125°C. This IC is commonly used as a brushless DC motor controller in various applications.

Median Price

$6.690

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 32 parts In-Stock

1+ parts

$6.690

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Vyrian

USA . 965 parts In-Stock

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Chip Stock

USA . 575 parts In-Stock

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575

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Prism Electronics

USA . 1 parts In-Stock

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Corohmni

South Africa . 4,880 parts In-Stock

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$6.690

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Continental Prestige Electronics

USA . 1,305 parts In-Stock

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$6.690

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$6.556

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$6.556

AZTECH Wire

Italy . 479 parts In-Stock

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$14.108

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479

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Marpe Global Electronics

Taiwan . 5,183 parts In-Stock

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XL Components Corporation

Australia . 3,695 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Argo Parts USA

USA . 2,338 parts In-Stock

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QualityLine Systems

Poland . 2,283 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$6.556

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$6.356

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$6.222

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$6.222

Perfect Parts

USA . 235 parts In-Stock

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Overview

Experience precise and efficient motion control with the TMC603A-LA by Microchip Technology. As a leading manufacturer, Microchip Technology ensures top-notch quality and reliability in their products. The TMC603A-LA belongs to the Motion Control ICs category and offers numerous advantages across various applications. With its surface mount capability, compact square package shape, and low profile design, this IC delivers exceptional performance without compromising space. With a nominal supply voltage of 5V and a wide temperature range, it guarantees optimal operation in any environment. Trust the TMC603A-LA to provide unparalleled value, benefits, and advantages, making it the ideal choice for all your motion control needs.

Feature Benefit Bullets

Surface Mount: YES

This product can be easily installed on a surface, providing convenience and flexibility in various applications.

No. of Functions: 1

With a single function, this product is straightforward and dedicated to a specific motion control task, ensuring optimal performance.

Package Shape: SQUARE

The square shape of this product allows for efficient space utilization, making it suitable for compact designs.

Nominal Supply Voltage (Vsup): 5 V

Operating at a stable voltage of 5V, this motion control IC provides consistent and reliable power for smooth and precise control.

No. of Terminals: 52

With 52 terminals, this IC offers versatile connectivity options, accommodating a wide range of input and output connections.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier package style with a heat sink/slug and a very thin profile optimizes thermal dissipation, enhancing the overall reliability and performance of the product.

Maximum Operating Temperature: 125 °C

This motion control IC can operate reliably at high temperatures up to 125°C, ensuring its suitability for demanding industrial environments.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme temperatures as low as -40°C, this product is suitable for a wide range of applications, even in arctic or frigid conditions.

Terminal Position: QUAD

With a quad terminal position, this IC facilitates easy installation and ensures secure connections, minimizing the risk of electrical disturbances.

Maximum Seated Height: 0.9 mm

With a low maximum seated height of just 0.9 mm, this motion control IC is ideal for applications where space constraints are a concern.

Width (mm): 8 mm

With a compact width of 8 mm, this IC offers a small footprint, enabling integration into space-limited designs.

Other IC type: BRUSHLESS DC MOTOR CONTROLLER

This product is specifically designed as a brushless DC motor controller, making it an ideal choice for precise and efficient motor control applications.

Minimum Supply Voltage (Vsup): 4.75 V

With a low minimum supply voltage requirement of 4.75V, this IC allows for compatibility with a wide range of power sources, ensuring versatility in diverse applications.

Length: 8 mm

The compact length of 8 mm further contributes to the footprint of this motion control IC, enabling integration in space-constrained designs.

Maximum Supply Current (Isup): 4.4 mA

Operating with a low maximum supply current of 4.4 mA, this IC minimizes power consumption, leading to energy-efficient performance.

Technology: CMOS

Utilizing CMOS technology, this motion control IC provides low power consumption, high integration capabilities, and excellent noise immunity, ensuring reliable operation.

Terminal Form: NO LEAD

The no-lead terminal form of this IC simplifies the assembly process, contributing to overall ease of use and reducing potential manufacturing issues.

Terminal Pitch: 0.5 mm

With a narrow terminal pitch of 0.5 mm, this IC facilitates high-density PCB layouts, enabling compact designs and minimizing signal interference.

Maximum Supply Voltage (Vsup): 5.25 V

Capable of operating safely within a maximum supply voltage of 5.25V, this motion control IC offers a wide tolerance for input voltage fluctuations, ensuring robust performance.

Technical Specifications

Motion Control ICs TMC603A-LA attributes and parameters. Explore more Motion Control ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-XQCC-N52

Length:

8 mm

No. of Functions:

1

No. of Terminals:

52

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC52,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.9 mm

Maximum Supply Current (Isup):

4.4 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

8 mm

Trade Compliance

TMC603A-LA Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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