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FNA51060TD2

Onsemi

FNA51060TD2 by Onsemi

FNA51060TD2 by Onsemi is a Motion Control IC with 20 terminals, operating at 14-16.5V. It features a max output current of 10A and technology hybrid design. Ideal for AC motor control applications due to its compact rectangular package style and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,472 parts In-Stock

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Digiode

USA . 806 parts In-Stock

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806

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TANS Electronics

Latvia . 6,353 parts In-Stock

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Problanco Electronics

Mexico . 5,309 parts In-Stock

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SupplyDigital Components

Austria . 2,943 parts In-Stock

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Kulean Microsystems

USA . 2,011 parts In-Stock

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Corphita

USA . 1,196 parts In-Stock

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Northwest PG Solutions

USA . 849 parts In-Stock

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Native Components

USA . 490 parts In-Stock

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UHIMA Technologies

Türkiye . 478 parts In-Stock

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Corohmni

South Africa . 155 parts In-Stock

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Overview

Experience superior motion control with the FNA51060TD2 by Onsemi. As a leader in the industry, Onsemi delivers high-quality products that excel in performance and reliability. The FNA51060TD2 is ideal for a wide range of applications in the motion control category, offering customers unparalleled value and benefits. Whether you're looking to enhance your AC motor controller or improve your overall system efficiency, this product provides advanced technology and precision engineering to meet your needs. Trust Onsemi to elevate your motion control experience with the FNA51060TD2.

Feature Benefit Bullets

Package Shape: RECTANGULAR

The rectangular shape makes this product easy to integrate into various electronic systems, providing flexibility in design and placement.

Nominal Supply Voltage (Vsup): 15 V

Operating at a nominal supply voltage of 15V ensures consistent and efficient performance of the motion control IC.

No. of Terminals: 20

With 20 terminals, this motion control IC offers plenty of connectivity options for different components, making it versatile in application.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

The microelectronic assembly package style allows for compact and space-saving design, ideal for applications where size is a constraint.

Terminal Position: DUAL

The dual terminal position provides redundancy and reliability in connections, minimizing the risk of disconnection or malfunction.

Maximum Seated Height: 6 mm

With a low maximum seated height of 6mm, this motion control IC can be easily integrated into slim and compact electronic devices.

Width (mm): 21 mm

The width of 21mm offers a balance between compactness and ease of integration, making it suitable for a wide range of applications.

Other IC type: AC MOTOR CONTROLLER

Being an AC motor controller, this product is designed specifically for controlling AC motors, ensuring efficient and precise motor control.

Minimum Supply Voltage (Vsup): 14 V

Operating at a minimum supply voltage of 14V allows for flexibility in power sources while maintaining stable operation of the motion control IC.

Length: 37 mm

The length of 37mm strikes a balance between compactness and functionality, making it suitable for various electronic applications.

Maximum Supply Current (Isup): 2.5 mA

The low maximum supply current of 2.5mA ensures minimal power consumption, making this motion control IC energy-efficient and cost-effective.

Maximum Output Current: 10 A

With a maximum output current of 10A, this motion control IC is capable of driving high-power motors, providing ample power for industrial applications.

Technology: HYBRID

The use of hybrid technology combines the advantages of different technologies, offering a balance between performance, efficiency, and reliability in an integrated package.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures robust and secure connections, suitable for applications where mechanical stress or vibration may be present.

Maximum Supply Voltage (Vsup): 16.5 V

Operating at a maximum supply voltage of 16.5V provides a safety margin for voltage variations, ensuring the stability and integrity of the motion control IC.

Technical Specifications

Motion Control ICs FNA51060TD2 attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XDMA-T20

Length:

37 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Output Current:

10 A

Package Body Material:

UNSPECIFIED

Package Code:

DMA

Package Equivalence Code:

MODULE,20LEAD,1.0

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

6 mm

Maximum Supply Current (Isup):

2.5 mA

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

14 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

HYBRID

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Width (mm):

21 mm

Trade Compliance

FNA51060TD2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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