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FES16CT

Onsemi

FES16CT by Onsemi

FES16CT by Onsemi is a single rectifier diode with a max output current of 16A and a max reverse recovery time of 0.035us. It is designed for fast recovery applications, operating b/w -65 to 150 °C, with a max power dissipation of 7.81W.

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Vyrian

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Digiode

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Ack Elektronik San.Tic.Ltd.Sti

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Lakeview Electronics

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ACDS - Activité Composants Distribution Service

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Bristol Electronics

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Inventory MP

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Native Components

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Northwest PG Solutions

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Problanco Electronics

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SupplyDigital Components

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UHIMA Technologies

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Overview

Elevate your electronics with the FES16CT by Onsemi, a high-quality rectifier diode designed for fast recovery applications. Manufactured by Onsemi, a trusted name in the industry, this diode offers reliable performance and durability. Whether you're working on power supplies, converters, or motor drives, the FES16CT provides the efficiency and precision you need to get the job done. Experience the value of superior technology and unlock new possibilities for your projects with the FES16CT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the diode, ensuring longevity and reliability in various operating conditions.

Maximum Reverse Recovery Time: 0.035 us

Fast reverse recovery time allows for efficient switching and high-speed operation, making it ideal for fast recovery applications.

Maximum Reverse Current: 10 uA

Low reverse current minimizes power loss and improves efficiency of the diode.

Maximum Operating Temperature: 150 °C

Wide operating temperature range enables the diode to perform consistently in different environments.

Maximum Power Dissipation: 7.81 W

High power dissipation capability allows the diode to handle large amounts of power without overheating.

Maximum Output Current: 16 A

High output current rating makes this diode suitable for applications requiring high current levels.

Technical Specifications

Diodes & Rectifiers FES16CT attributes and parameters. Explore more Diodes & Rectifiers devices from Onsemi

Specs

Additional Features:

HIGH RELIABILITY

Application:

FAST RECOVERY

Case Connection:

CATHODE

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.95 V

JEDEC-95 Code:

TO-220AC

JESD-30 Code:

R-PSFM-T2

Maximum Non Repetitive Peak Forward Current:

250 A

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Maximum Output Current:

16 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Maximum Power Dissipation:

7.81 W

Maximum Repetitive Peak Reverse Voltage:

150 V

Maximum Reverse Current:

10 uA

Maximum Reverse Recovery Time:

.035 us

Surface Mount:

NO

Terminal Form:

Terminal Position:

Trade Compliance

FES16CT Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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