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FDS89161

Onsemi

FDS89161 by Onsemi

FDS89161 by Onsemi is a N-CHANNEL FET with 2 elements, built-in diode for SWITCHING applications. Features include 100V DS Breakdown Voltage, 2.7A Drain Current, and 0.105 ohm On Resistance. Suitable for surface mount with GULL WING terminals in a RECTANGULAR package shape.

Median Price

$1.297

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 448 parts In-Stock

1+ parts

$1.069

100+ parts

$0.797

1k+ parts

$0.715

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448

$1.069

$0.797

$0.715

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Chip1Stop

Japan . 158 parts In-Stock

1+ parts

$1.525

100+ parts

$0.713

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158

$1.525

$0.713

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Mouser Electronics

USA . 4,139 parts In-Stock

1+ parts

$1.720

100+ parts

$1.030

1k+ parts

$0.773

10k+ parts

$0.750

4,139

$1.720

$1.030

$0.773

$0.750

DigiKey

USA . 8,722 parts In-Stock

1+ parts

$2.350

100+ parts

$1.028

1k+ parts

$0.802

10k+ parts

$0.655

8,722

$2.350

$1.028

$0.802

$0.655

Verical

USA . 1,808 parts In-Stock

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-

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$0.924

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$0.824

1,808

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$0.824

Rochester

USA . 1,808 parts In-Stock

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-

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$0.890

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$0.739

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$0.659

1,808

-

$0.890

$0.739

$0.659

Distributors (In-Stock)

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Digiode

USA . 1,783 parts In-Stock

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$0.760

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1,783

$0.760

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Nova Conductors

Japan . 10 parts In-Stock

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$0.814

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10

$0.814

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TME

Poland . 2,192 parts In-Stock

1+ parts

$1.110

100+ parts

$0.950

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2,192

$1.110

$0.950

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Kruse Electronics AG

Switzerland . 10,000 parts In-Stock

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Kruse

Germany . 10,000 parts In-Stock

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NAC Semi

USA . 7,500 parts In-Stock

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$0.755

7,500

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$0.755

Vyrian

USA . 4,574 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,300 parts In-Stock

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North Shore Components

USA . 1,072 parts In-Stock

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Pegasus Components GmbH

Germany . 1,035 parts In-Stock

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Cyclops Electronics Ltd

UK . 3 parts In-Stock

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3

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Distributors (Availability)

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Ampacity Inc.

Singapore . 4,477 parts In-Stock

1+ parts

$0.560

100+ parts

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4,477

$0.560

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Corohmni

South Africa . 233 parts In-Stock

1+ parts

$0.653

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233

$0.653

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Corphita

USA . 791 parts In-Stock

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$0.720

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791

$0.720

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Component Stockers USA

USA . 10,907 parts In-Stock

1+ parts

$1.390

100+ parts

$1.020

1k+ parts

$0.660

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10,907

$1.390

$1.020

$0.660

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Andel Nordic

Denmark . 4,533 parts In-Stock

1+ parts

$3.503

100+ parts

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$3.363

10k+ parts

$3.363

4,533

$3.503

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$3.363

$3.363

Microchip USA

USA . 5,030 parts In-Stock

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$4.878

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$4.878

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Perfect Parts

USA . 65,066 parts In-Stock

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Kulean Microsystems

USA . 5,646 parts In-Stock

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Lixinc

USA . 4,499 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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Problanco Electronics

Mexico . 2,692 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$0.798

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$0.774

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$0.757

2,000

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$0.798

$0.774

$0.757

TANS Electronics

Latvia . 1,951 parts In-Stock

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UHIMA Technologies

Türkiye . 555 parts In-Stock

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555

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Supply Digital

USA . 436 parts In-Stock

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SupplyDigital Components

Austria . 6 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the FDS89161 by Onsemi. This small signal field effect transistor offers unparalleled quality and reliability, making it the ideal choice for switching applications. With a maximum drain current of 2.7 A and a minimum DS breakdown voltage of 100 V, this transistor is designed to deliver exceptional performance. Say goodbye to inefficiencies and hello to seamless operation with the FDS89161. Join the league of satisfied customers who have experienced the value and benefits of this innovative product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the FET, ensuring reliable performance over time.

Polarity or Channel Type: N-CHANNEL

N-channel FETs have lower ON resistance, higher transconductance, and better high-frequency performance compared to P-channel FETs, making them suitable for various applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can effectively control the flow of current in electronic circuits, making it ideal for power management and control.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and placement on circuit boards, improving overall assembly efficiency.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally-off devices, offering better control over the power flow and reducing the risk of unwanted current leakage in the circuit.

Maximum Drain Current (Abs) (ID): 2.7 A

The high maximum drain current rating of 2.7 A allows this FET to handle higher power loads, making it suitable for applications that require efficient current management.

Maximum Power Dissipation (Abs): 3.1 W

With a maximum power dissipation of 3.1 W, this FET can effectively dissipate heat generated during operation, preventing overheating and ensuring long-term reliability.

Maximum Drain-Source On Resistance: 0.105 ohm

The low drain-source on resistance of 0.105 ohm minimizes power losses and improves efficiency in the circuit, making this FET an energy-efficient choice.

Technical Specifications

Small Signal Field Effect Transistors (FET) FDS89161 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

2.7 A

Maximum Drain Current (ID):

2.7 A

Maximum Drain-Source On Resistance:

.105 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5 pF

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDS89161 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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