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FDS8449-F085

Onsemi

FDS8449-F085 by Onsemi

FDS8449-F085 by Onsemi is a N-CHANNEL FET with 40V DS Breakdown Voltage and 7.6A Drain Current. Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE in a PLASTIC/EPOXY package. Operating in ENHANCEMENT MODE, it has a max power dissipation of 2.5W and can withstand temperatures up to 150°C.

Median Price

$1.255

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 600 parts In-Stock

1+ parts

$1.255

100+ parts

$1.255

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$1.255

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600

$1.255

$1.255

$1.255

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,888 parts In-Stock

1+ parts

$1.192

100+ parts

-

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2,888

$1.192

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Nova Conductors

Japan . 25 parts In-Stock

1+ parts

$1.230

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25

$1.230

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Vyrian

USA . 7,452 parts In-Stock

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Flip Electronics

USA . 5,000 parts In-Stock

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5,000

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Distributors (Availability)

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Ampacity Inc.

Singapore . 698 parts In-Stock

1+ parts

$1.070

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698

$1.070

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Semicontronic

India . 594 parts In-Stock

1+ parts

$1.070

100+ parts

$1.043

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$1.038

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594

$1.070

$1.043

$1.038

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Corphita

USA . 1,134 parts In-Stock

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$1.130

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1,134

$1.130

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Corohmni

South Africa . 281 parts In-Stock

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$1.181

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281

$1.181

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$1.205

100+ parts

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$1.157

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500

$1.205

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$1.157

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Continental Prestige Electronics

USA . 8,893 parts In-Stock

1+ parts

$1.230

100+ parts

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$1.205

8,893

$1.230

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$1.205

Argo Parts USA

USA . 7,969 parts In-Stock

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$1.230

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7,969

$1.230

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Netroflash

USA . 1,000 parts In-Stock

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$1.230

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$1.169

10k+ parts

$1.144

1,000

$1.230

-

$1.169

$1.144

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$1.255

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$1.255

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$1.255

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600

$1.255

$1.255

$1.255

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Aztec Data Supply Inc.

USA . 1,533 parts In-Stock

1+ parts

$1.790

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1,533

$1.790

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AZTECH Wire

Italy . 823 parts In-Stock

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$10.923

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823

$10.923

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Kepictronics

USA . 306,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 24,426 parts In-Stock

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Lixinc

USA . 7,624 parts In-Stock

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Kulean Microsystems

USA . 7,495 parts In-Stock

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Perfect Parts

USA . 6,278 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Problanco Electronics

Mexico . 4,334 parts In-Stock

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SupplyDigital Components

Austria . 2,677 parts In-Stock

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Supply Digital

USA . 1,216 parts In-Stock

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UHIMA Technologies

Türkiye . 225 parts In-Stock

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225

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TANS Electronics

Latvia . 86 parts In-Stock

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Overview

Discover the unparalleled performance and reliability of the FDS8449-F085 by Onsemi, a leading manufacturer in the field of Small Signal Field Effect Transistors (FET). Ideal for switching applications, this N-channel transistor with a built-in diode offers a maximum drain current of 7.6A and a minimum DS breakdown voltage of 40V. With a small outline package and high-quality materials, this enhancement mode transistor ensures efficient operation and optimal power dissipation. Trust Onsemi to deliver cutting-edge technology and unmatched value with the FDS8449-F085, perfect for a wide range of electronic applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have better performance characteristics and higher efficiency compared to P-channel transistors.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance in such scenarios.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40V, this transistor can handle higher voltages without any issues.

Maximum Drain Current (Abs): 7.6 A

Capable of handling high drain current, making it suitable for applications that require high power output.

Maximum Power Dissipation (Abs): 2.5 W

Can dissipate heat effectively up to 2.5W, ensuring stable operation even under high power conditions.

Maximum Operating Temperature: 150 °C

Can operate efficiently at high temperatures up to 150°C, suitable for harsh environment applications.

Maximum Drain-Source On Resistance: 0.029 ohm

Low on-resistance ensures minimal power loss and high efficiency in conducting current between drain and source.

Technical Specifications

Small Signal Field Effect Transistors (FET) FDS8449-F085 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

7.6 A

Maximum Drain Current (ID):

7.6 A

Maximum Drain-Source On Resistance:

.029 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDS8449-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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