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FDPF8D5N10C

Onsemi

FDPF8D5N10C by Onsemi

FDPF8D5N10C by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage and 304A IDM. Ideal for SWITCHING applications, it features a single configuration with built-in diode and operates in ENHANCEMENT MODE. With a max power dissipation of 35W, this transistor has an operating temperature range of -55 to 175 °C.

Median Price

$4.860

Lifecycle Status

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6

In-Stock Inventory

1k+

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DigiKey

USA . 667 parts In-Stock

1+ parts

$4.860

100+ parts

$2.299

1k+ parts

$1.904

10k+ parts

-

667

$4.860

$2.299

$1.904

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Chip1Stop

Japan . 240 parts In-Stock

1+ parts

$13.700

100+ parts

$5.640

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240

$13.700

$5.640

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Rochester

USA . 2,206 parts In-Stock

1+ parts

-

100+ parts

$1.830

1k+ parts

$1.640

10k+ parts

$1.540

2,206

-

$1.830

$1.640

$1.540

Distributors (In-Stock)

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Digiode

USA . 761 parts In-Stock

1+ parts

$1.938

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761

$1.938

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Flip Electronics

USA . 8,295 parts In-Stock

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8,295

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Vyrian

USA . 6,779 parts In-Stock

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6,779

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Native Components

USA . 609 parts In-Stock

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$0.110

100+ parts

-

1k+ parts

-

10k+ parts

$0.105

609

$0.110

-

-

$0.105

Northwest PG Solutions

USA . 2,009 parts In-Stock

1+ parts

$0.121

100+ parts

-

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$0.106

2,009

$0.121

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$0.106

Corohmni

South Africa . 126 parts In-Stock

1+ parts

$1.121

100+ parts

-

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126

$1.121

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Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$1.346

100+ parts

$1.225

1k+ parts

$1.104

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-

600

$1.346

$1.225

$1.104

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Corphita

USA . 770 parts In-Stock

1+ parts

$1.836

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770

$1.836

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Microchip USA

USA . 8,803 parts In-Stock

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$26.845

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8,803

$26.845

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Perfect Parts

USA . 5,555 parts In-Stock

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TANS Electronics

Latvia . 5,408 parts In-Stock

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Problanco Electronics

Mexico . 3,322 parts In-Stock

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Kulean Microsystems

USA . 1,081 parts In-Stock

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1,081

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SupplyDigital Components

Austria . 659 parts In-Stock

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UHIMA Technologies

Türkiye . 656 parts In-Stock

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656

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GreenTree Electronics

Israel . 340 parts In-Stock

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340

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Authorized Procurement Solutions

USA . 240 parts In-Stock

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240

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Overview

Unlock the power of efficient switching with the FDPF8D5N10C by Onsemi. Crafted with precision and expertise, this N-channel Power Field Effect Transistor boasts a single configuration with a built-in diode, making it ideal for various applications. Experience seamless operation with its high performance while enjoying the benefits of enhanced energy efficiency and reliability. Trust in Onsemi's reputation for quality and innovation, as this product delivers value and advantages that will elevate your projects to new heights. Elevate your designs with the FDPF8D5N10C today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher efficiency compared to P-channel FETs, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse voltage spikes, offering added convenience and reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently control the flow of current, making it a reliable choice for power management.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this FET can handle higher voltages without breakdown, ensuring reliability in high-power applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and efficient use of space on circuit boards, optimizing overall system design.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and ease of soldering, making installation and assembly hassle-free.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easy and precise control of current flow, making them suitable for a wide range of applications requiring efficient power management.

Maximum Pulsed Drain Current (IDM): 304 A

The high pulsed drain current rating allows the FET to handle sudden surges in current without overheating, ensuring reliable performance under heavy loads.

Avalanche Energy Rating (EAS): 181 mJ

The high avalanche energy rating indicates the FET's ability to withstand transient voltage spikes, providing protection for the device and the circuit.

Maximum Drain Current (Abs) (ID): 76 A

With a high drain current rating, this FET can handle high current applications with ease, ensuring stable operation under demanding conditions.

No. of Terminals: 3

The three-terminal configuration simplifies circuit connections and offers flexibility in circuit design, enabling versatile applications.

Maximum Power Dissipation (Abs): 35 W

The high power dissipation rating allows the FET to handle high power levels without overheating, ensuring long-term reliability in demanding environments.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers secure mounting and thermal management, making it suitable for applications where heat dissipation is critical.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and fast switching speeds, making this FET ideal for high-performance applications requiring precise control.

Maximum Power Dissipation Ambient: 2.4 W

The low power dissipation in ambient conditions helps improve energy efficiency and reduces heat generation, enhancing overall system performance.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this FET can withstand elevated temperatures, making it suitable for industrial or automotive applications.

Transistor Element Material: SILICON

Silicon transistors offer high reliability and efficiency, making them a popular choice for various electronic applications requiring stable and consistent performance.

Maximum Turn On Time (ton): 42 ns

The fast turn-on time helps improve switching efficiency and reduces power losses, making this FET suitable for high-frequency switching applications.

Minimum Operating Temperature: -55 °C

With a wide operating temperature range, this FET can function reliably in harsh environments or extreme temperatures, ensuring consistent performance.

Maximum Turn Off Time (toff): 38 ns

The fast turn-off time minimizes switching losses and improves overall efficiency, making this FET ideal for high-speed switching applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides corrosion resistance and improves solderability, ensuring reliable connections and long-term performance.

Maximum Drain-Source On Resistance: 0.0085 ohm

With low on-resistance, this FET minimizes power losses and heat generation, enhancing efficiency and performance in power management applications.

Terminal Position: SINGLE

The single terminal position simplifies circuit connections and ensures consistent performance in various applications, offering ease of use and reliability.

Case Connection: ISOLATED

The isolated case connection provides electrical insulation and reduces the risk of short circuits, enhancing safety and reliability in circuits with multiple components.

Maximum Feedback Capacitance (Crss): 25 pF

The low feedback capacitance minimizes signal distortion and improves high-frequency performance, making this FET suitable for fast switching and signal processing applications.

Technical Specifications

Power Field Effect Transistors (FET) FDPF8D5N10C attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

181 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

76 A

Maximum Drain Current (ID):

76 A

Maximum Drain-Source On Resistance:

.0085 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

25 pF

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

2.4 W

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

304 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

38 ns

Maximum Turn On Time (ton):

42 ns

Trade Compliance

FDPF8D5N10C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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