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FDP8876

Onsemi

FDP8876 by Onsemi

The Onsemi FDP8876 is a N-CHANNEL Power FET with 30V DS Breakdown Voltage and 70A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, 0.0105 ohm On Resistance, and operates in ENHANCEMENT MODE. Suitable for high-power circuits requiring efficient switching capabilities.

Median Price

$0.396

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 401 parts In-Stock

1+ parts

-

100+ parts

$0.396

1k+ parts

$0.329

10k+ parts

$0.293

401

-

$0.396

$0.329

$0.293

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,445 parts In-Stock

1+ parts

$0.309

100+ parts

-

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1,445

$0.309

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Vyrian

USA . 7,894 parts In-Stock

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7,894

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LWI Electronics Inc

India . 29 parts In-Stock

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29

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Prism Electronics

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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Corphita

USA . 367 parts In-Stock

1+ parts

$0.292

100+ parts

-

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367

$0.292

-

-

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Corohmni

South Africa . 451 parts In-Stock

1+ parts

$0.325

100+ parts

-

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451

$0.325

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Component Stockers USA

USA . 563 parts In-Stock

1+ parts

$0.330

100+ parts

$0.310

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-

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563

$0.330

$0.310

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Native Components

USA . 438 parts In-Stock

1+ parts

$0.799

100+ parts

-

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438

$0.799

-

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Northwest PG Solutions

USA . 99 parts In-Stock

1+ parts

$0.879

100+ parts

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99

$0.879

-

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Andel Nordic

Denmark . 295 parts In-Stock

1+ parts

$5.548

100+ parts

-

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$5.326

10k+ parts

$5.326

295

$5.548

-

$5.326

$5.326

Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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QUARKTWIN TECHNOLOGY LTD

USA . 22,054 parts In-Stock

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22,054

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Kulean Microsystems

USA . 7,882 parts In-Stock

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7,882

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SupplyDigital Components

Austria . 5,179 parts In-Stock

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5,179

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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TANS Electronics

Latvia . 3,368 parts In-Stock

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3,368

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Supply Digital

USA . 1,776 parts In-Stock

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1,776

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Problanco Electronics

Mexico . 949 parts In-Stock

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949

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UHIMA Technologies

Türkiye . 470 parts In-Stock

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470

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Kepictronics

USA . 80 parts In-Stock

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80

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Perfect Parts

USA . 11 parts In-Stock

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11

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Overview

Experience unparalleled power and performance with the FDP8876 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are perfect for various switching applications. With a single configuration and built-in diode, this N-CHANNEL transistor offers efficient operation and enhanced functionality. Trust Onsemi to provide reliable products that exceed expectations and meet your needs. Upgrade your systems today with the FDP8876 and discover the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components of the field effect transistor.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance and efficiency compared to P-channel transistors, making this product a good choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and can improve overall system efficiency.

Transistor Application: SWITCHING

Designed for switching applications, this field effect transistor can efficiently control the flow of current in electronic circuits.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltages without damage, making it suitable for a wide range of applications.

Maximum Drain Current (Abs) (ID): 70 A

The high maximum drain current rating of 70A allows this transistor to handle heavy loads and high power applications with ease.

Maximum Power Dissipation (Abs): 70 W

With a maximum power dissipation of 70W, this FET can operate efficiently even under high power conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability, making this FET a robust choice for various electronic designs.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175 °C ensures that this field effect transistor can withstand elevated temperatures without compromising performance.

Technical Specifications

Power Field Effect Transistors (FET) FDP8876 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

180 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

70 A

Maximum Drain Current (ID):

70 A

Maximum Drain-Source On Resistance:

.0105 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDP8876 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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