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FDP8442-F085

Onsemi

FDP8442-F085 by Onsemi

FDP8442-F085 by Onsemi is a N-CHANNEL Power FET with 40V DS Breakdown Voltage and 23A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, 0.0031 ohm On Resistance, and 254W Power Dissipation in a RECTANGULAR package.

Median Price

$1.610

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 270 parts In-Stock

1+ parts

$0.492

100+ parts

$0.448

1k+ parts

$0.403

10k+ parts

-

270

$0.492

$0.448

$0.403

-

Flip Electronics (Authorized)

USA . 4,400 parts In-Stock

1+ parts

-

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4,400

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Rochester

USA . 800 parts In-Stock

1+ parts

-

100+ parts

$1.610

1k+ parts

$1.340

10k+ parts

$1.190

800

-

$1.610

$1.340

$1.190

DigiKey

USA . 750 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$2.010

10k+ parts

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750

-

-

$2.010

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,502 parts In-Stock

1+ parts

$0.467

100+ parts

-

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1,502

$0.467

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-

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Vyrian

USA . 1,583 parts In-Stock

1+ parts

$0.492

100+ parts

-

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1,583

$0.492

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Flip Electronics

USA . 4,400 parts In-Stock

1+ parts

-

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4,400

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DigiKey Marketplace

USA . 4,400 parts In-Stock

1+ parts

-

100+ parts

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4,400

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,309 parts In-Stock

1+ parts

$0.443

100+ parts

-

1k+ parts

-

10k+ parts

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1,309

$0.443

-

-

-

Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$0.492

100+ parts

$0.448

1k+ parts

$0.403

10k+ parts

-

270

$0.492

$0.448

$0.403

-

Corohmni

South Africa . 202 parts In-Stock

1+ parts

$0.492

100+ parts

-

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202

$0.492

-

-

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Native Components

USA . 563 parts In-Stock

1+ parts

$1.644

100+ parts

-

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563

$1.644

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Northwest PG Solutions

USA . 1,659 parts In-Stock

1+ parts

$1.808

100+ parts

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1,659

$1.808

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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QUARKTWIN TECHNOLOGY LTD

USA . 19,717 parts In-Stock

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19,717

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Microchip USA

USA . 9,761 parts In-Stock

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9,761

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TANS Electronics

Latvia . 7,820 parts In-Stock

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7,820

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Kulean Microsystems

USA . 6,487 parts In-Stock

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6,487

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Problanco Electronics

Mexico . 5,848 parts In-Stock

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5,848

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Supply Digital

USA . 2,571 parts In-Stock

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2,571

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SupplyDigital Components

Austria . 2,069 parts In-Stock

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2,069

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-

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Continental Prestige Electronics

USA . 800 parts In-Stock

1+ parts

-

100+ parts

$1.290

1k+ parts

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800

-

$1.290

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UHIMA Technologies

Türkiye . 246 parts In-Stock

1+ parts

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100+ parts

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246

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Overview

Unleash the power of innovation with the FDP8442-F085 by Onsemi, a leading manufacturer in the industry. This Power Field Effect Transistor (FET) offers unparalleled performance and reliability for various switching applications. With its N-CHANNEL configuration and built-in diode, this transistor ensures efficient operation and enhanced functionality. Experience superior quality and value with the FDP8442-F085, delivering maximum power dissipation and a high avalanche energy rating. Trust Onsemi to provide cutting-edge technology that exceeds expectations, making every project a success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and good heat dissipation, making the product reliable in different operating conditions.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower ON-resistance and higher switching speeds compared to P-Channel FETs, making them suitable for various switching applications.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40 V, this FET can handle higher voltages without breakdown, suitable for applications that require higher voltage levels.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally OFF and can be turned ON by applying a positive voltage to the gate terminal, offering better control in switching applications.

Maximum Drain Current (ID): 23 A

With a high maximum drain current rating of 23 A, this FET can handle high current loads, making it suitable for power applications.

Maximum Power Dissipation (Abs): 254 W

The high power dissipation rating of 254 W ensures that the FET can handle significant power levels without overheating, suitable for power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor FETs offer high input impedance, low ON-resistance, and high switching speeds, making them ideal for various applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this FET can operate reliably in high-temperature environments without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) FDP8442-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

720 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

23 A

Maximum Drain Current (ID):

23 A

Maximum Drain-Source On Resistance:

.0031 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDP8442-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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