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FDP8860

Onsemi

FDP8860 by Onsemi

FDP8860 by Onsemi is a N-CHANNEL Power FET with 30V DS Breakdown Voltage. Ideal for SWITCHING applications, it features a max IDM of 556A and EAS of 673mJ. With a max ID of 219A and 0.0029 ohm RDS(on), this transistor operates in ENHANCEMENT MODE at up to 175°C.

Median Price

$1.538

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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Rochester

USA . 14,977 parts In-Stock

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-

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$1.480

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$1.230

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$1.100

14,977

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$1.480

$1.230

$1.100

DigiKey

USA . 14,977 parts In-Stock

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$1.850

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14,977

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$1.850

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Verical

USA . 13,482 parts In-Stock

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$1.538

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$1.375

13,482

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$1.538

$1.375

Flip Electronics (Authorized)

USA . 800 parts In-Stock

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Freelance Electronics

USA . 26 parts In-Stock

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$0.947

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26

$0.947

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Digiode

USA . 68 parts In-Stock

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$1.150

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68

$1.150

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Vyrian

USA . 2,366 parts In-Stock

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$1.210

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DigiKey Marketplace

USA . 17,481 parts In-Stock

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Flip Electronics

USA . 17,400 parts In-Stock

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Prism Electronics

USA . 68 parts In-Stock

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68

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Corel Iberica Componentes, S.L.

Spain . 44 parts In-Stock

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Advanced Electronics

New Zealand . 600 parts In-Stock

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$0.454

100+ parts

$0.413

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$0.372

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600

$0.454

$0.413

$0.372

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Corphita

USA . 657 parts In-Stock

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$1.089

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Corohmni

South Africa . 389 parts In-Stock

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$1.224

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Native Components

USA . 763 parts In-Stock

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$5.987

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Perfect Parts

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GreenTree Electronics

Israel . 24,700 parts In-Stock

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Authorized Procurement Solutions

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Lixinc

USA . 9,587 parts In-Stock

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Problanco Electronics

Mexico . 4,390 parts In-Stock

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TANS Electronics

Latvia . 2,784 parts In-Stock

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SupplyDigital Components

Austria . 2,780 parts In-Stock

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Supply Digital

USA . 2,715 parts In-Stock

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UHIMA Technologies

Türkiye . 862 parts In-Stock

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Northwest PG Solutions

USA . 67 parts In-Stock

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$5.867

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Assy Fe

Spain . 44 parts In-Stock

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Kulean Microsystems

USA . 3 parts In-Stock

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Overview

Power up your applications with the FDP8860 by Onsemi, a high-quality power field effect transistor designed for efficient switching operations. Manufactured by Onsemi, a trusted name in semiconductor technology, this N-channel transistor offers reliability and performance that you can count on. With a built-in diode and enhancement mode operation, this transistor is perfect for a variety of applications. Experience the value and benefits of the FDP8860, from its impressive power dissipation capabilities to its low drain-source on resistance. Upgrade your electronics with the FDP8860 and unleash the full potential of your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the transistor.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have better performance characteristics compared to P-Channel FETs, making this transistor a suitable choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides reverse polarity protection and simplifies circuit design, making this transistor a convenient choice.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable operation in various electronic circuits.

Minimum DS Breakdown Voltage: 30 V

With a high breakdown voltage, this transistor can handle higher voltages without failing, making it suitable for demanding applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and placement in circuit boards, making installation hassle-free.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and facilitate easy soldering during circuit assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input impedance and low ON-state resistance, ensuring efficient operation in switching applications.

Maximum Pulsed Drain Current (IDM): 556 A

With a high pulsed drain current rating, this transistor can handle short bursts of high current without overheating or damage.

Avalanche Energy Rating (EAS): 673 mJ

The high avalanche energy rating ensures the transistor can withstand transient voltage spikes, making it reliable in high-performance applications.

Maximum Drain Current (Abs) (ID): 219 A

With a high drain current rating, this transistor can handle continuous current flow without overheating or performance degradation.

No. of Terminals: 3

The 3 terminals provide necessary connections for efficient operation and easy integration into electronic circuits.

Maximum Power Dissipation (Abs): 254 W

The high power dissipation rating ensures the transistor can handle significant power levels without overheating or failing.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging offers secure mounting and heat dissipation, ensuring reliable operation in various environmental conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high performance and reliability, making this transistor suitable for critical applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this transistor can withstand elevated temperatures without performance degradation.

Transistor Element Material: SILICON

Silicon transistors offer excellent performance characteristics and reliability, ensuring long-term operation in diverse applications.

Terminal Finish: MATTE TIN

Matte tin finish offers corrosion resistance and ensures reliable electrical connections for optimal performance.

Maximum Drain Current (ID): 80 A

High drain current rating allows for efficient operation in high-current applications, ensuring reliable performance under load.

Maximum Drain-Source On Resistance: 0.0029 ohm

Low ON resistance minimizes power losses and improves efficiency in switching applications, making this transistor an excellent choice for high-performance circuits.

Terminal Position: SINGLE

Single terminal position simplifies circuit design and integration, making this transistor easy to use in various electronic applications.

Technical Specifications

Power Field Effect Transistors (FET) FDP8860 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

673 mJ

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

219 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0029 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

556 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDP8860 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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