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FDP8441_F085

Onsemi

FDP8441_F085 by Onsemi

FDP8441_F085 by Onsemi is a N-CHANNEL Power FET with 40V DS Breakdown Voltage and 80A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, 947mJ Avalanche Energy Rating, and 0.0027 ohm On Resistance. Operating in ENHANCEMENT MODE, it has a max power dissipation of 300W at 175 °C.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 1,672 parts In-Stock

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Vyrian

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Native Components

USA . 838 parts In-Stock

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$1.612

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Northwest PG Solutions

USA . 1,259 parts In-Stock

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Lixinc

USA . 17,653 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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A-Z Elektronik GmbH

Germany . 5,250 parts In-Stock

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SupplyDigital Components

Austria . 4,120 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

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TANS Electronics

Latvia . 2,187 parts In-Stock

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Corphita

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Supply Digital

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UHIMA Technologies

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Problanco Electronics

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Corohmni

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Overview

Unleash the power of innovation with the Onsemi FDP8441_F085 Power Field Effect Transistor. Manufactured by a trusted industry leader, this N-CHANNEL transistor offers unparalleled performance in switching applications. With a high DS breakdown voltage and built-in diode, this transistor ensures reliable operation and efficiency. From automotive to industrial electronics, this versatile component delivers exceptional value and benefits to customers looking for quality and reliability in their designs. Take your projects to the next level with the Onsemi FDP8441_F085.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides insulation and protection for the internal components, ensuring reliability and durability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher electron mobility, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient freewheeling inductive loads, providing a comprehensive solution for various switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high efficiency and fast switching speeds.

Minimum DS Breakdown Voltage: 40 V

The minimum breakdown voltage of 40V ensures reliable operation and protection against voltage spikes.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and stable connection in PCB applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off devices, providing control and efficiency in switching applications.

Avalanche Energy Rating (EAS): 947 mJ

The high avalanche energy rating of 947mJ ensures robustness and reliability under high-energy transient conditions.

Maximum Drain Current (Abs) (ID): 80 A

The high maximum drain current rating of 80A allows for handling high power applications with ease.

No. of Terminals: 3

With three terminals, this FET provides the necessary connections for proper operation and control.

Maximum Power Dissipation (Abs): 300 W

The high maximum power dissipation rating of 300W ensures the FET can handle high-power applications without overheating.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for easy mounting and heat dissipation in various mounting configurations.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology offers high efficiency, low on-resistance, and fast switching speeds.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this FET can operate reliably in high-temperature environments.

Transistor Element Material: SILICON

Silicon-based FETs offer high performance, reliability, and efficiency in various applications.

Maximum Drain-Source On Resistance: 0.0027 ohm

The low on-resistance of 0.0027 ohm ensures minimal voltage drop and high efficiency in conducting current.

Terminal Position: SINGLE

Having a single terminal position simplifies installation and connection, making it user-friendly.

Case Connection: DRAIN

The drain case connection provides a reliable grounding point for the FET, enhancing overall performance and stability.

Technical Specifications

Power Field Effect Transistors (FET) FDP8441_F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

947 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

23 A

Maximum Drain-Source On Resistance:

.0027 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDP8441_F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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