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FDMS86150ET100

Onsemi

FDMS86150ET100 by Onsemi

FDMS86150ET100 by Onsemi is a N-CHANNEL FET with 100V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 617A and EAS of 726mJ, making it suitable for high-power operations. With a package style of SMALL OUTLINE and operating temperature range from -55 to 175 °C, it offers versatility in various electronic designs.

Median Price

$5.150

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 3,000 parts In-Stock

1+ parts

$4.061

100+ parts

$3.305

1k+ parts

-

10k+ parts

$3.294

3,000

$4.061

$3.305

-

$3.294

Mouser Electronics

USA . 1,645 parts In-Stock

1+ parts

$8.350

100+ parts

$4.460

1k+ parts

$4.180

10k+ parts

-

1,645

$8.350

$4.460

$4.180

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DigiKey

USA . 1,267 parts In-Stock

1+ parts

$8.900

100+ parts

$4.460

1k+ parts

$4.418

10k+ parts

-

1,267

$8.900

$4.460

$4.418

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Arrow

USA . 3,000 parts In-Stock

1+ parts

-

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$3.613

3,000

-

-

-

$3.613

Verical

USA . 3,000 parts In-Stock

1+ parts

-

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$6.239

3,000

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-

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$6.239

Rochester

USA . 2,305 parts In-Stock

1+ parts

-

100+ parts

$3.610

1k+ parts

$3.230

10k+ parts

$3.040

2,305

-

$3.610

$3.230

$3.040

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,949 parts In-Stock

1+ parts

$3.629

100+ parts

-

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-

2,949

$3.629

-

-

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$4.037

100+ parts

-

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50

$4.037

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-

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Chip Stock

USA . 53,000 parts In-Stock

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53,000

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Vyrian

USA . 4,965 parts In-Stock

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4,965

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Bristol Electronics

USA . 1,197 parts In-Stock

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1,197

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Flip Electronics

USA . 1,124 parts In-Stock

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1,124

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Speed Components Ltd

Israel . 9 parts In-Stock

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9

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,803 parts In-Stock

1+ parts

$1.641

100+ parts

-

1k+ parts

-

10k+ parts

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3,803

$1.641

-

-

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Ampacity Inc.

Singapore . 4,924 parts In-Stock

1+ parts

$3.250

100+ parts

-

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4,924

$3.250

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Semicontronic

India . 4,638 parts In-Stock

1+ parts

$3.250

100+ parts

$3.169

1k+ parts

$3.152

10k+ parts

-

4,638

$3.250

$3.169

$3.152

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Corphita

USA . 2,161 parts In-Stock

1+ parts

$3.438

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2,161

$3.438

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Corohmni

South Africa . 149 parts In-Stock

1+ parts

$3.820

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149

$3.820

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$3.956

100+ parts

-

1k+ parts

$3.798

10k+ parts

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50

$3.956

-

$3.798

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Continental Prestige Electronics

USA . 5,609 parts In-Stock

1+ parts

$4.037

100+ parts

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$3.956

5,609

$4.037

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-

$3.956

Argo Parts USA

USA . 750 parts In-Stock

1+ parts

$4.037

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-

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750

$4.037

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$4.042

100+ parts

$4.042

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$4.042

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100

$4.042

$4.042

$4.042

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QUARKTWIN TECHNOLOGY LTD

USA . 23,058 parts In-Stock

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Problanco Electronics

Mexico . 8,244 parts In-Stock

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SupplyDigital Components

Austria . 7,190 parts In-Stock

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Microchip USA

USA . 5,782 parts In-Stock

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5,782

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Kulean Microsystems

USA . 5,393 parts In-Stock

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Infinite Electronics LLP (Excess)

. 977 parts In-Stock

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977

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Supply Digital

USA . 583 parts In-Stock

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583

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UHIMA Technologies

Türkiye . 432 parts In-Stock

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432

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TANS Electronics

Latvia . 368 parts In-Stock

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368

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Overview

Unleash the power of innovation with the FDMS86150ET100 by Onsemi. As a leader in Power Field Effect Transistors (FET), Onsemi delivers top-quality products that redefine industry standards. This N-CHANNEL transistor, with its built-in diode, is perfect for switching applications. Offering a maximum power dissipation of 187W and a low on-resistance of 0.00485 ohm, this transistor ensures optimal performance and efficiency. Enhance your projects with the FDMS86150ET100's reliable operation and robust design, making it the ultimate choice for demanding applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package material offers good thermal conductivity and insulation, making the transistor durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower on-resistance and higher switching speeds compared to P-channel transistors, making them suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in protecting the transistor from reverse current flow, improving the overall reliability of the switching circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient on/off transitions and minimal power loss during operation.

Maximum Pulsed Drain Current (IDM): 617 A

High pulsed drain current rating enables the transistor to handle short-term high-power demands without failure, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 187 W

With a high power dissipation rating, the transistor can effectively handle heat generated during operation, ensuring reliable performance under high load conditions.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows the transistor to operate in harsh environments without overheating, ensuring reliable performance in demanding applications.

Technical Specifications

Power Field Effect Transistors (FET) FDMS86150ET100 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

726 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

128 A

Maximum Drain Current (ID):

128 A

Maximum Drain-Source On Resistance:

.00485 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

50 pF

JEDEC-95 Code:

MO-240AA

JESD-30 Code:

R-PDSO-N5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

617 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

57 ns

Maximum Turn On Time (ton):

50 ns

Trade Compliance

FDMS86150ET100 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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