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FDMC89521L

Onsemi

FDMC89521L by Onsemi

FDMC89521L by Onsemi is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V. It is used for switching applications and has a max drain current of 8.2A and a max drain-source on resistance of 0.017 ohm.

Median Price

$1.251

Lifecycle Status

Suppliers In-Stock

18

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1k+

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Arrow

USA . 63,014 parts In-Stock

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$0.635

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$0.635

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Chip1Stop

Japan . 2,891 parts In-Stock

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$1.200

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$0.941

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$0.897

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2,891

$1.200

$0.941

$0.897

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Farnell

UK . 4,083 parts In-Stock

1+ parts

$1.720

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$0.944

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$0.744

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$0.685

4,083

$1.720

$0.944

$0.744

$0.685

Newark

USA . 2,924 parts In-Stock

1+ parts

$2.490

100+ parts

$1.110

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$0.864

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2,924

$2.490

$1.110

$0.864

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Mouser Electronics

USA . 143 parts In-Stock

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$2.570

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$1.300

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$1.080

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$1.010

143

$2.570

$1.300

$1.080

$1.010

Verical

USA . 1,821 parts In-Stock

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-

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$0.983

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$0.912

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1,821

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$0.912

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Element14

Singapore . 474 parts In-Stock

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$1.251

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$1.184

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$0.985

474

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$1.251

$1.184

$0.985

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,557 parts In-Stock

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$0.942

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2,557

$0.942

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Nova Conductors

Japan . 10 parts In-Stock

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$1.070

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10

$1.070

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Zilex Electronics Inc.

Canada . 188,699 parts In-Stock

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Flip Electronics

USA . 126,000 parts In-Stock

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Chip Stock

USA . 21,500 parts In-Stock

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IBS Electronics

USA . 18,000 parts In-Stock

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$1.260

18,000

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$1.260

Vyrian

USA . 15,065 parts In-Stock

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15,065

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NAC Semi

USA . 6,000 parts In-Stock

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$1.380

6,000

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$1.380

ComSIT Distribution GmbH

Germany . 579 parts In-Stock

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579

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Prism Electronics

USA . 32 parts In-Stock

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NexGen Digital

USA . 4 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 15,148 parts In-Stock

1+ parts

$0.640

100+ parts

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15,148

$0.640

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Corohmni

South Africa . 54 parts In-Stock

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$0.750

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54

$0.750

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Aztec Data Supply Inc.

USA . 4,973 parts In-Stock

1+ parts

$0.849

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4,973

$0.849

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Corphita

USA . 944 parts In-Stock

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$0.893

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944

$0.893

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Bastille Electronics

Australia . 38 parts In-Stock

1+ parts

$1.070

100+ parts

$1.016

1k+ parts

$0.966

10k+ parts

$0.952

38

$1.070

$1.016

$0.966

$0.952

Argo Parts USA

USA . 1,628 parts In-Stock

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$1.070

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1,628

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Semicontronic

India . 15,168 parts In-Stock

1+ parts

$1.390

100+ parts

$1.355

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$1.348

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15,168

$1.390

$1.355

$1.348

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Component Stockers USA

USA . 28,803 parts In-Stock

1+ parts

$1.540

100+ parts

$1.120

1k+ parts

$0.780

10k+ parts

$0.730

28,803

$1.540

$1.120

$0.780

$0.730

Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$1.645

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$1.563

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$1.563

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2,000

$1.645

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$1.563

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Microchip USA

USA . 2,905 parts In-Stock

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$6.216

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Glotronic Ltd.

UK . 31,200 parts In-Stock

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RC Electronics

USA . 20,000 parts In-Stock

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$1.090

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$1.000

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$0.970

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$1.090

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Eastek

USA . 9,000 parts In-Stock

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GreenTree Electronics

Israel . 8,700 parts In-Stock

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SupplyDigital Components

Austria . 5,927 parts In-Stock

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Perfect Parts

USA . 5,891 parts In-Stock

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Kulean Microsystems

USA . 4,507 parts In-Stock

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TANS Electronics

Latvia . 4,401 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Kepictronics

USA . 2,118 parts In-Stock

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Supply Digital

USA . 2,108 parts In-Stock

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Continental Prestige Electronics

USA . 1,770 parts In-Stock

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$1.230

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$0.834

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$0.834

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Assy Fe

Spain . 1,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 510 parts In-Stock

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510

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Problanco Electronics

Mexico . 235 parts In-Stock

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UHIMA Technologies

Türkiye . 82 parts In-Stock

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Overview

Experience the superior quality and reliability of Onsemi's FDMC89521L Small Signal Field Effect Transistor (FET). With its N-CHANNEL configuration and built-in diode, this transistor is perfect for switching applications. Its square package shape and no lead terminal form make it easy to install, while its enhancement mode ensures efficient operation. With a maximum power dissipation of 16W and a minimum DS breakdown voltage of 60V, this transistor delivers exceptional performance. Trust Onsemi for top-notch technology and choose the FDMC89521L for your next project.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and protection for the small signal field effect transistor, making it suitable for various applications.

Polarity or Channel Type

N-CHANNEL - The N-channel configuration allows for efficient switching operations, making this transistor ideal for applications that require high-speed switching.

Configuration

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE - The separate configuration with built-in diode enhances the functionality of the transistor, enabling it to efficiently handle switching tasks while also providing added protection against reverse current.

Transistor Application

SWITCHING - Designed specifically for switching applications, this transistor excels in controlling current flow and rapidly switching between on and off states.

Surface Mount

YES - The surface mount capability enables easy and convenient installation on circuit boards, making it suitable for compact designs and high-density applications.

Minimum DS Breakdown Voltage

60 V - With a high DS breakdown voltage, this transistor can handle higher voltage levels, ensuring reliable and safe operation in various electronic systems.

Package Shape

SQUARE - The square package shape allows for efficient use of space, making this transistor an ideal choice for applications where compact size is essential.

Terminal Form

NO LEAD - The no-lead terminal form simplifies the installation process and reduces the risk of soldering issues, making it user-friendly and reliable.

Operating Mode

ENHANCEMENT MODE - The enhancement mode operation provides improved control and accuracy in switching operations, making this transistor suitable for applications that require precise control over current flow.

No. of Elements

2 - With two elements incorporated into the transistor, it offers increased functionality and versatility for various circuit designs.

No. of Terminals

4 - The four-terminal configuration allows for efficient connectivity and versatile circuit design options, making it suitable for complex electronic systems.

Maximum Power Dissipation (Abs)

16 W - With a high maximum power dissipation rating, this transistor can handle substantial power loads, making it reliable and effective in demanding applications.

Package Style (Meter)

SMALL OUTLINE - The small outline package style provides a compact and space-saving solution, making this transistor ideal for applications with size constraints.

Field Effect Transistor Technology

METAL-OXIDE SEMICONDUCTOR - Employing metal-oxide semiconductor technology enhances the transistor's performance, offering improved efficiency, reliability, and reduced leakage current.

Maximum Power Dissipation Ambient

1.9 W - With a low maximum power dissipation rating in ambient conditions, this transistor minimizes the heat generated during operation, contributing to its overall reliability and longevity.

Maximum Operating Temperature

150 °C - The high maximum operating temperature allows this transistor to function effectively even in applications where elevated temperatures are present.

Transistor Element Material

SILICON - The use of silicon as the transistor element material ensures excellent electrical properties, making it a reliable choice for a wide range of applications.

Minimum Operating Temperature

55 °C - With a minimum operating temperature of -55 °C, this transistor can withstand and function reliably in extreme cold environments.

Terminal Finish

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) - The terminal finish consisting of multiple metals provides excellent conductivity and resistance against corrosion, ensuring the longevity and reliability of the transistor's connections.

Maximum Drain Current (ID)

8.2 A - With a high maximum drain current rating, this transistor can handle significant current loads, making it suitable for applications that require high power output.

Maximum Drain-Source On Resistance

0.017 ohm - The low maximum drain-source on resistance minimizes power loss and ensures efficient operation, making this transistor suitable for high-performance applications.

Terminal Position

DUAL - The dual terminal configuration allows for flexible and versatile circuit designs, accommodating various layout requirements and simplifying the installation process.

Moisture Sensitivity Level (MSL)

1 - With a moisture sensitivity level of 1, this transistor is highly resistant to moisture ingress, ensuring long-term reliability and preventing electrical malfunctions.

Case Connection

DRAIN - The case connection to the drain enhances the transistor's thermal management and ensures efficient heat dissipation during operation, contributing to its overall reliability and longevity.

Maximum Feedback Capacitance (Crss)

15 pF - The low maximum feedback capacitance reduces the risk of unwanted oscillations and improves the transistor's stability, making it desirable for applications that require precise control and signal integrity.

Technical Specifications

Small Signal Field Effect Transistors (FET) FDMC89521L attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE ENERGY RATED

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

8.2 A

Maximum Drain-Source On Resistance:

.017 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

15 pF

JESD-30 Code:

S-PDSO-N4

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

1.9 W

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDMC89521L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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