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FDMC6296

Onsemi

FDMC6296 by Onsemi

FDMC6296 by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage and 11.5A Drain Current, ideal for SWITCHING applications. It features a PLASTIC/EPOXY package, SINGLE configuration with BUILT-IN DIODE, and operates in ENHANCEMENT MODE at up to 150 °C.

Median Price

$0.708

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 28,445 parts In-Stock

1+ parts

$0.426

100+ parts

-

1k+ parts

-

10k+ parts

-

28,445

$0.426

-

-

-

DigiKey

USA . 20,197 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.650

10k+ parts

$0.650

20,197

-

-

$0.650

$0.650

Rochester

USA . 17,026 parts In-Stock

1+ parts

-

100+ parts

$0.766

1k+ parts

$0.636

10k+ parts

$0.567

17,026

-

$0.766

$0.636

$0.567

Verical

USA . 11,624 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.795

10k+ parts

$0.709

11,624

-

-

$0.795

$0.709

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 851 parts In-Stock

1+ parts

$0.405

100+ parts

-

1k+ parts

-

10k+ parts

-

851

$0.405

-

-

-

Vyrian

USA . 3,342 parts In-Stock

1+ parts

$0.426

100+ parts

-

1k+ parts

-

10k+ parts

-

3,342

$0.426

-

-

-

DigiKey Marketplace

USA . 20,197 parts In-Stock

1+ parts

-

100+ parts

$0.650

1k+ parts

-

10k+ parts

-

20,197

-

$0.650

-

-

ACDS - Activité Composants Distribution Service

France . 2,967 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,967

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-

-

-

Bristol Electronics

USA . 2,967 parts In-Stock

1+ parts

-

100+ parts

$0.619

1k+ parts

$0.429

10k+ parts

-

2,967

-

$0.619

$0.429

-

Dan-Mar Components

USA . 2,967 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,967

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,436 parts In-Stock

1+ parts

$0.383

100+ parts

-

1k+ parts

-

10k+ parts

-

2,436

$0.383

-

-

-

Continental Prestige Electronics

USA . 20,197 parts In-Stock

1+ parts

$0.426

100+ parts

-

1k+ parts

-

10k+ parts

-

20,197

$0.426

-

-

-

Corohmni

South Africa . 76 parts In-Stock

1+ parts

$0.426

100+ parts

-

1k+ parts

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10k+ parts

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76

$0.426

-

-

-

Microchip USA

USA . 178 parts In-Stock

1+ parts

$3.900

100+ parts

-

1k+ parts

-

10k+ parts

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178

$3.900

-

-

-

Native Components

USA . 620 parts In-Stock

1+ parts

$146.720

100+ parts

-

1k+ parts

-

10k+ parts

$140.851

620

$146.720

-

-

$140.851

Northwest PG Solutions

USA . 1,126 parts In-Stock

1+ parts

$161.392

100+ parts

-

1k+ parts

-

10k+ parts

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1,126

$161.392

-

-

-

Problanco Electronics

Mexico . 7,681 parts In-Stock

1+ parts

-

100+ parts

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7,681

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-

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SupplyDigital Components

Austria . 6,615 parts In-Stock

1+ parts

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100+ parts

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6,615

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-

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Kulean Microsystems

USA . 4,644 parts In-Stock

1+ parts

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100+ parts

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4,644

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-

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TANS Electronics

Latvia . 3,899 parts In-Stock

1+ parts

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100+ parts

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3,899

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-

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Supply Digital

USA . 1,246 parts In-Stock

1+ parts

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100+ parts

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1,246

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UHIMA Technologies

Türkiye . 85 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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85

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-

Overview

Experience superior performance and reliability with the FDMC6296 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Small Signal Field Effect Transistors (FET) that are perfect for switching applications. With a maximum drain current of 11.5 A and a low drain-source on resistance, this N-channel transistor offers exceptional power dissipation and efficiency. The package's square shape and surface mount capability make it easy to integrate into various electronic devices. Trust Onsemi for cutting-edge technology and elevate your projects with the FDMC6296.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight, durable, and cost-effective.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors typically offer higher mobility and faster switching speeds than P-CHANNEL transistors.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable operation in such scenarios.

Surface Mount: YES

Surface mount capability allows for easy and space-saving integration onto circuit boards.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30 V, this transistor can handle higher voltages without failure.

Maximum Drain Current (Abs) (ID): 11.5 A

Capable of handling high current loads, making it suitable for applications requiring significant power.

Maximum Power Dissipation (Abs): 2.1 W

With a maximum power dissipation of 2.1 W, this transistor can effectively dissipate heat, ensuring stability during operation.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C allows for reliable performance even in demanding environmental conditions.

Maximum Drain-Source On Resistance: 0.0105 ohm

Low on-resistance results in minimal power loss and high efficiency in switching applications.

Maximum Feedback Capacitance (Crss): 225 pF

Low feedback capacitance minimizes the risk of parasitic oscillations and improves stability in circuit designs.

Technical Specifications

Small Signal Field Effect Transistors (FET) FDMC6296 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

11.5 A

Maximum Drain Current (ID):

11.5 A

Maximum Drain-Source On Resistance:

.0105 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

225 pF

JESD-30 Code:

S-PDSO-N5

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDMC6296 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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