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FDMC8200

Onsemi

FDMC8200 by Onsemi

FDMC8200 by Onsemi is a small signal N-CHANNEL FET with 2 elements and built-in diode, ideal for switching applications. It has a min DS breakdown voltage of 30V, max drain current of 18A, and max power dissipation of 1.9W. This surface mount transistor operates in enhancement mode and has a max operating temperature of 150°C.

Median Price

$0.572

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$1.390

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$0.580

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$0.411

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$0.336

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$0.336

Chip1Stop

Japan . 2,850 parts In-Stock

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$3.610

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$1.510

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$0.979

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Rochester

USA . 69,000 parts In-Stock

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$0.394

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$0.327

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DigiKey

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$0.490

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Verical

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$0.572

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Digiode

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Nova Conductors

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DigiKey Marketplace

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Chip Stock

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Corphita

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Argo Parts USA

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Continental Prestige Electronics

USA . 660 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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Component Stockers USA

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$0.720

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$0.480

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Microchip USA

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RC Electronics

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Metaverse IC Inc.

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QUARKTWIN TECHNOLOGY LTD

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Kulean Microsystems

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Assy Fe

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SupplyDigital Components

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Overview

Experience the power and precision of the FDMC8200 by Onsemi. As a leading manufacturer in the industry, Onsemi is committed to delivering exceptional quality in every product they create. The FDMC8200, a small signal Field Effect Transistor, offers incredible advantages for a variety of applications. With its N-channel polarity and built-in diode, this transistor is perfect for switching applications. Its compact square shape and surface mount capability make installation a breeze. With a minimum DS breakdown voltage of 30V and maximum pulsed drain current of 40A, the FDMC8200 provides unmatched performance. Trust Onsemi and the FDMC8200 to deliver value, benefits, and advantages that will exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protects the internal components, making this product suitable for various applications.

Polarity or Channel Type: N-CHANNEL

With N-channel polarity, this small signal FET offers low on-resistance and fast switching speed, making it ideal for power switching applications.

Configuration: SERIES, 2 ELEMENTS WITH BUILT-IN DIODE

The series configuration with two elements and a built-in diode allows for efficient circuit design and integration, offering versatility and increased functionality.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides efficient and reliable performance, making it a great choice for applications that require precise on/off control.

Surface Mount: YES

With surface mount capability, this FET can be easily mounted onto circuit boards, saving space and allowing for efficient manufacturing processes.

Minimum DS Breakdown Voltage: 30 V

The minimum DS breakdown voltage of 30V ensures that this FET can handle higher voltage requirements, making it suitable for applications that demand reliable operation under varying voltage conditions.

Package Shape: SQUARE

The square package shape provides stability and ease of mounting, making it compatible with different circuit designs and ensuring secure positioning.

Terminal Form: NO LEAD

The no-lead terminal form enhances the product's reliability by eliminating the risk of lead-related issues, while also simplifying the manufacturing and assembly process.

Operating Mode: ENHANCEMENT MODE

With an enhancement mode operating mode, this FET offers low on-resistance and high current capability, making it a favorable choice for various amplification and switching applications.

No. of Elements: 2

Equipped with two elements, this FET provides increased functionality and versatility, making it suitable for more complex circuit designs.

Maximum Pulsed Drain Current (IDM): 40 A

The high maximum pulsed drain current of 40A allows this FET to handle heavy loads and transient conditions, making it an excellent choice for applications that require reliable and efficient power switching.

Maximum Drain Current (Abs) (ID): 18 A

With a maximum drain current of 18A, this FET can handle high current applications, providing robust and reliable performance.

No. of Terminals: 8

With eight terminals, this FET allows for easy interconnection with other components, enabling seamless integration into various circuit designs.

Maximum Power Dissipation (Abs): 1.9 W

The high maximum power dissipation of 1.9W ensures that this FET can handle high power levels, making it suitable for applications that require efficient power management.

Package Style (Meter): SMALL OUTLINE

The small outline package style provides compactness and easy integration into space-constrained systems, making it a preferred choice for applications where size is a critical factor.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Featuring metal-oxide semiconductor technology, this FET offers improved performance in terms of low power consumption, high efficiency, and reduced noise, making it an optimal choice for a wide range of applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150°C, this FET can operate reliably even in demanding thermal conditions, ensuring stable performance and longevity.

Transistor Element Material: SILICON

The silicon transistor element material provides excellent thermal and electrical properties, making this FET highly reliable and efficient in various applications.

Maximum Turn On Time (ton): 30 ns

With a quick maximum turn-on time of 30ns, this FET enables fast switching and precise control, making it suitable for applications that require rapid response times.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C allows this FET to perform reliably even in extreme cold environments, making it suitable for a wide range of operating conditions.

Maximum Turn Off Time (toff): 66 ns

The maximum turn-off time of 66ns ensures fast switching characteristics and improves overall system efficiency, making this FET an ideal choice for applications that require rapid switching speeds.

Terminal Finish: Nickel/Gold/Palladium (Ni/Au/Pd)

The terminal finish with nickel, gold, and palladium provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable and long-lasting connections.

Maximum Drain Current (ID): 8 A

With a maximum drain current of 8A, this FET is capable of handling moderate current loads, making it suitable for various power management applications.

Maximum Drain-Source On Resistance: 0.02 ohm

The low maximum drain-source on resistance of 0.02 ohm reduces power losses and improves efficiency, making this FET an optimal choice for applications that require minimal energy dissipation.

Terminal Position: DUAL

Featuring dual terminal positions, this FET provides flexibility in circuit design and allows for efficient interconnection with other components, enhancing overall system functionality.

Moisture Sensitivity Level (MSL): 1

With a moisture sensitivity level of 1, this FET can withstand mild moisture exposure during assembly and storage, ensuring its reliability and longevity.

Case Connection: DRAIN SOURCE

The case connection at the drain source enhances heat dissipation and can be utilized for efficient thermal management, making this FET suitable for applications where temperature control is crucial.

Maximum Feedback Capacitance (Crss): 30 pF

With a maximum feedback capacitance of 30pF, this FET offers improved stability and reduced signal distortion, making it a preferred choice for high-frequency applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) FDMC8200 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN SOURCE

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

18 A

Maximum Drain Current (ID):

8 A

Maximum Drain-Source On Resistance:

.02 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

30 pF

JESD-30 Code:

S-PDSO-N8

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

40 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Nickel/Gold/Palladium (Ni/Au/Pd)

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

66 ns

Maximum Turn On Time (ton):

30 ns

Trade Compliance

FDMC8200 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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