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FDMC6675BZ

Onsemi

FDMC6675BZ by Onsemi

FDMC6675BZ by Onsemi is a P-CHANNEL Power FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features 40A Drain Current, 0.0144 ohm On Resistance, and operates in ENHANCEMENT MODE. This transistor has a max power dissipation of 36W and can withstand temperatures up to 150 °C.

Median Price

$0.603

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 354 parts In-Stock

1+ parts

$0.183

100+ parts

$0.175

1k+ parts

$0.172

10k+ parts

-

354

$0.183

$0.175

$0.172

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Chip1Stop

Japan . 2,985 parts In-Stock

1+ parts

$0.397

100+ parts

-

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2,985

$0.397

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Mouser Electronics

USA . 2,934 parts In-Stock

1+ parts

$1.870

100+ parts

$0.796

1k+ parts

$0.526

10k+ parts

$0.498

2,934

$1.870

$0.796

$0.526

$0.498

DigiKey

USA . 2,558 parts In-Stock

1+ parts

$1.870

100+ parts

$0.796

1k+ parts

$0.574

10k+ parts

$0.441

2,558

$1.870

$0.796

$0.574

$0.441

Rochester

USA . 204,553 parts In-Stock

1+ parts

-

100+ parts

$0.592

1k+ parts

$0.491

10k+ parts

$0.438

204,553

-

$0.592

$0.491

$0.438

Verical

USA . 191,225 parts In-Stock

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-

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$0.614

10k+ parts

$0.547

191,225

-

-

$0.614

$0.547

Flip Electronics (Authorized)

USA . 42,000 parts In-Stock

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-

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42,000

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Distributors (In-Stock)

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Vyrian

USA . 945 parts In-Stock

1+ parts

$0.349

100+ parts

-

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945

$0.349

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Digiode

USA . 444 parts In-Stock

1+ parts

$0.460

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444

$0.460

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Martec Srl

Italy . 150,000 parts In-Stock

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150,000

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Component Sense

UK . 77,649 parts In-Stock

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77,649

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Flip Electronics

USA . 42,000 parts In-Stock

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42,000

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Sensible Micro Corp

USA . 12,750 parts In-Stock

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12,750

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Cyclops Electronics Ltd

UK . 3,455 parts In-Stock

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3,455

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Inventory MP

USA . 1,592 parts In-Stock

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1,592

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Bristol Electronics

USA . 1,592 parts In-Stock

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1,592

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SPM Sales

USA . 520 parts In-Stock

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520

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Prism Electronics

USA . 264 parts In-Stock

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264

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Avant Electronics Limited

UK . 18 parts In-Stock

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18

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Speed Components Ltd

Israel . 15 parts In-Stock

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 100 parts In-Stock

1+ parts

$0.349

100+ parts

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100

$0.349

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Corphita

USA . 1,634 parts In-Stock

1+ parts

$0.436

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1,634

$0.436

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Microchip USA

USA . 9,691 parts In-Stock

1+ parts

$3.362

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9,691

$3.362

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Native Components

USA . 178 parts In-Stock

1+ parts

$41.444

100+ parts

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$39.786

178

$41.444

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$39.786

Northwest PG Solutions

USA . 529 parts In-Stock

1+ parts

$45.588

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529

$45.588

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Metaverse IC Inc.

Canada . 139,090 parts In-Stock

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RC Electronics

USA . 81,421 parts In-Stock

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$0.590

1k+ parts

$0.540

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$0.530

81,421

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$0.590

$0.540

$0.530

Kepictronics

USA . 63,000 parts In-Stock

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Perfect Parts

USA . 50,434 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 20,666 parts In-Stock

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

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GreenTree Electronics

Israel . 9,000 parts In-Stock

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Assy Fe

Spain . 4,600 parts In-Stock

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4,600

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SupplyDigital Components

Austria . 4,141 parts In-Stock

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Problanco Electronics

Mexico . 3,307 parts In-Stock

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Kulean Microsystems

USA . 3,076 parts In-Stock

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TANS Electronics

Latvia . 3,073 parts In-Stock

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3,073

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iodParts Technologies Inc.

India . 2,995 parts In-Stock

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$0.756

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2,995

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$0.756

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UHIMA Technologies

Türkiye . 560 parts In-Stock

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560

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Supply Digital

USA . 508 parts In-Stock

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508

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Overview

Discover the power and efficiency of the FDMC6675BZ from Onsemi, a leading manufacturer in the industry. This P-Channel Power Field Effect Transistor is perfect for switching applications, offering reliability and high performance. With a maximum drain current of 40A and a low on-resistance of 0.0144 ohm, this transistor provides exceptional value and benefits to customers looking for quality components. Upgrade your electronic projects with the FDMC6675BZ and experience the difference that Onsemi's technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection to the internal components of the FET.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-state resistance and high switching speeds, making them suitable for efficient power management applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies the circuit design and provides additional protection against reverse current flow.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently turn on and off high current loads with minimal power loss.

Surface Mount: YES

Being surface mountable makes it easier to integrate this FET into compact electronic devices and minimizes the space required for installation.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltages without the risk of damaging the device, making it suitable for a wide range of applications.

Maximum Power Dissipation (Abs): 36 W

The high power dissipation capability of 36W ensures reliable performance even under heavy load conditions.

Maximum Drain Current (Abs) (ID): 40 A

With a maximum drain current of 40A, this FET can handle high current loads without overheating, offering robust power management capabilities.

Maximum Drain-Source On Resistance: 0.0144 ohm

The low on-resistance of 0.0144 ohm minimizes power loss and heat generation, ensuring efficient operation of the FET.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C allows this FET to operate reliably in a wide range of environmental conditions.

Technical Specifications

Power Field Effect Transistors (FET) FDMC6675BZ attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

9.5 A

Maximum Drain-Source On Resistance:

.0144 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N5

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

32 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDMC6675BZ Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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