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FDD8896-F085

Onsemi

FDD8896-F085 by Onsemi

FDD8896-F085 by Onsemi is a N-CHANNEL Power FET with 30V DS Breakdown Voltage and 94A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, operates in ENHANCEMENT MODE, and has an EAS of 168mJ. Perfect for high-power circuit designs requiring efficient switching capabilities.

Median Price

$0.573

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 47,136 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.572

10k+ parts

-

47,136

-

-

$0.572

-

Verical

USA . 25,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.500

10k+ parts

-

25,680

-

-

$0.500

-

Rochester

USA . 972 parts In-Stock

1+ parts

-

100+ parts

$0.574

1k+ parts

$0.476

10k+ parts

$0.424

972

-

$0.574

$0.476

$0.424

DigiKey

USA . 972 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.720

10k+ parts

-

972

-

-

$0.720

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,885 parts In-Stock

1+ parts

$0.447

100+ parts

-

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1,885

$0.447

-

-

-

Nova Conductors

Japan . 51 parts In-Stock

1+ parts

$0.454

100+ parts

-

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51

$0.454

-

-

-

Chip Stock

USA . 85,220 parts In-Stock

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85,220

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Flip Electronics

USA . 42,500 parts In-Stock

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42,500

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-

-

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Vyrian

USA . 2,407 parts In-Stock

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2,407

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DigiKey Marketplace

USA . 973 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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973

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 37,204 parts In-Stock

1+ parts

$0.400

100+ parts

-

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37,204

$0.400

-

-

-

Corphita

USA . 3,243 parts In-Stock

1+ parts

$0.424

100+ parts

-

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3,243

$0.424

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-

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.445

100+ parts

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1k+ parts

$0.427

10k+ parts

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2,000

$0.445

-

$0.427

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Corohmni

South Africa . 345 parts In-Stock

1+ parts

$0.445

100+ parts

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345

$0.445

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-

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Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$0.454

100+ parts

$0.431

1k+ parts

$0.410

10k+ parts

$0.404

300

$0.454

$0.431

$0.410

$0.404

Component Stockers USA

USA . 1,364 parts In-Stock

1+ parts

$0.470

100+ parts

$0.450

1k+ parts

-

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1,364

$0.470

$0.450

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Perfect Parts

USA . 8,351 parts In-Stock

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8,351

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Problanco Electronics

Mexico . 7,679 parts In-Stock

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7,679

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SupplyDigital Components

Austria . 7,403 parts In-Stock

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7,403

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Kulean Microsystems

USA . 6,433 parts In-Stock

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6,433

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TANS Electronics

Latvia . 3,094 parts In-Stock

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3,094

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Continental Prestige Electronics

USA . 973 parts In-Stock

1+ parts

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100+ parts

$0.560

1k+ parts

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973

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$0.560

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Supply Digital

USA . 920 parts In-Stock

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920

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UHIMA Technologies

Türkiye . 813 parts In-Stock

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813

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Overview

Enhance your electronic devices with the high-quality FDD8896-F085 Power Field Effect Transistor by Onsemi. With a focus on excellence in manufacturing, Onsemi delivers reliable products that cater to a wide range of applications including switching. The FDD8896-F085 offers customers value and benefits through its single configuration with built-in diode, N-channel polarity, and enhanced mode of operation. Experience superior performance and efficiency with this transistor, making it a must-have component for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, perfect for applications where weight and size are important factors.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower on-resistance and higher efficiency compared to P-Channel FETs, making them suitable for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides reverse polarity protection, increasing the reliability of the product in critical applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient operation.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Drain Current (Abs) (ID): 94 A

The high maximum drain current rating allows for the handling of large currents, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 0.08 W

With a high power dissipation rating, this FET can handle heat and operate reliably under heavy loads.

Maximum Operating Temperature: 175 °C

The high operating temperature range ensures the FET can function in a wide variety of environments and applications.

Technical Specifications

Power Field Effect Transistors (FET) FDD8896-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

168 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

94 A

Maximum Drain-Source On Resistance:

.0068 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDD8896-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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