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FDD7N60NZTM

Onsemi

FDD7N60NZTM by Onsemi

FDD7N60NZTM by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage and 22A IDM. Ideal for SWITCHING applications, it features a built-in DIODE, 1.25 ohm RDS(on), and operates in ENHANCEMENT MODE.

Median Price

$1.080

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 447 parts In-Stock

1+ parts

$1.500

100+ parts

$1.120

1k+ parts

$0.900

10k+ parts

-

447

$1.500

$1.120

$0.900

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Rochester

USA . 322 parts In-Stock

1+ parts

-

100+ parts

$0.659

1k+ parts

$0.547

10k+ parts

$0.488

322

-

$0.659

$0.547

$0.488

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,419 parts In-Stock

1+ parts

$0.514

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2,419

$0.514

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Vyrian

USA . 2,771 parts In-Stock

1+ parts

$0.541

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2,771

$0.541

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ComSIT Distribution GmbH

Germany . 7,275 parts In-Stock

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7,275

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Flip Electronics

USA . 2,500 parts In-Stock

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2,500

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ACDS - Activité Composants Distribution Service

France . 1,544 parts In-Stock

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1,544

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Distributors (Availability)

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Corphita

USA . 2,833 parts In-Stock

1+ parts

$0.487

100+ parts

-

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2,833

$0.487

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Corohmni

South Africa . 267 parts In-Stock

1+ parts

$0.541

100+ parts

-

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267

$0.541

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Component Stockers USA

USA . 184 parts In-Stock

1+ parts

$0.560

100+ parts

$0.530

1k+ parts

-

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184

$0.560

$0.530

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Continental Prestige Electronics

USA . 447 parts In-Stock

1+ parts

$0.964

100+ parts

$0.633

1k+ parts

-

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447

$0.964

$0.633

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-

Native Components

USA . 126 parts In-Stock

1+ parts

$261.300

100+ parts

$256.074

1k+ parts

$253.461

10k+ parts

$250.848

126

$261.300

$256.074

$253.461

$250.848

Northwest PG Solutions

USA . 137 parts In-Stock

1+ parts

$287.430

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137

$287.430

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Perfect Parts

USA . 15,865 parts In-Stock

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15,865

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Cyclops Electronics Ltd (Excess)

UK . 7,946 parts In-Stock

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TANS Electronics

Latvia . 4,289 parts In-Stock

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4,289

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Problanco Electronics

Mexico . 3,112 parts In-Stock

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3,112

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Supply Digital

USA . 1,100 parts In-Stock

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1,100

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 587 parts In-Stock

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587

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Glotronic Ltd.

UK . 529 parts In-Stock

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529

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Kulean Microsystems

USA . 309 parts In-Stock

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309

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SupplyDigital Components

Austria . 13 parts In-Stock

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Overview

Unlock the power of innovation with the FDD7N60NZTM by Onsemi, a high-quality Power Field Effect Transistor (FET) designed for switching applications. Manufactured with precision and expertise, this N-CHANNEL transistor offers unbeatable performance and reliability. With a minimum DS breakdown voltage of 600V and a maximum drain-source on resistance of 1.25 ohm, this product guarantees efficiency and durability. Ideal for a wide range of industries, the FDD7N60NZTM provides customers with the value, benefits, and advantages they need for their projects to succeed. Trust Onsemi for superior quality and performance that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the FET, ensuring long-lasting performance.

Polarity or Channel Type: N-CHANNEL

Offers efficient switching capabilities for various electronic applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode within the FET.

Transistor Application: SWITCHING

Designed for efficient switching operations, suitable for a wide range of electronic devices.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort during assembly.

Minimum DS Breakdown Voltage: 600 V

Provides high voltage tolerance and reliability for demanding applications.

Maximum Pulsed Drain Current (IDM): 22 A

Capable of handling high current pulses, making it suitable for power applications.

Avalanche Energy Rating (EAS): 347 mJ

Offers protection against energy spikes and surges, ensuring stable operation.

Maximum Power Dissipation (Abs): 90 W

Can dissipate heat efficiently, enabling reliable performance under high load conditions.

Maximum Drain-Source On Resistance: 1.25 ohm

Low on-resistance minimizes power loss and improves efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) FDD7N60NZTM attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

347 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

5.5 A

Maximum Drain Current (ID):

5.5 A

Maximum Drain-Source On Resistance:

1.25 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

22 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDD7N60NZTM Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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