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FDD7N60NZ

Onsemi

FDD7N60NZ by Onsemi

FDD7N60NZ by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. Ideal for SWITCHING applications, it features a 22A Max Pulsed Drain Current and 347mJ Avalanche Energy Rating. With GULL WING terminals and ENHANCEMENT MODE operation, this transistor offers reliable performance in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,529 parts In-Stock

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Digiode

USA . 1,406 parts In-Stock

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Native Components

USA . 827 parts In-Stock

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$36.400

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$34.944

827

$36.400

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$34.944

Northwest PG Solutions

USA . 943 parts In-Stock

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$40.040

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943

$40.040

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Metaverse IC Inc.

Canada . 50,000 parts In-Stock

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TANS Electronics

Latvia . 6,488 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Problanco Electronics

Mexico . 5,544 parts In-Stock

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Corphita

USA . 2,911 parts In-Stock

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SupplyDigital Components

Austria . 1,165 parts In-Stock

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Kepictronics

USA . 1,000 parts In-Stock

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Kulean Microsystems

USA . 870 parts In-Stock

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Supply Digital

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UHIMA Technologies

Türkiye . 204 parts In-Stock

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Corohmni

South Africa . 86 parts In-Stock

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Overview

Discover the superior performance and reliability of the FDD7N60NZ by Onsemi, a leading manufacturer in the industry. As a power field effect transistor (FET) designed for switching applications, this N-channel transistor offers unmatched efficiency and precision. Its single configuration with built-in diode ensures seamless operation, while the maximum drain current of 5.5 A guarantees high performance. Ideal for a variety of applications, from industrial machinery to consumer electronics, this FET provides exceptional value and benefits to customers looking for quality components they can trust. Choose the FDD7N60NZ for unparalleled performance and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection to the internal components of the FET, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher transconductance, making them efficient for switching applications.

Transistor Application: SWITCHING

Designed for high-speed switching applications, this FET can handle rapid changes in voltage and current.

Surface Mount: YES

Being surface mountable means easy and convenient installation on circuit boards, saving space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle high voltage applications without failure.

Maximum Drain Current (ID): 5.5 A

A high maximum drain current rating allows the FET to handle heavy loads and currents, making it suitable for various applications.

Maximum Power Dissipation (Abs): 90 W

The high power dissipation rating indicates that this FET can handle significant power without overheating, ensuring reliable operation.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures, making it suitable for industrial and automotive applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers improved performance and reliability in FETs, making them a preferred choice for many applications.

Technical Specifications

Power Field Effect Transistors (FET) FDD7N60NZ attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

347 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

5.5 A

Maximum Drain Current (ID):

5.5 A

Maximum Drain-Source On Resistance:

1.25 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

10 pF

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

22 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

150 ns

Maximum Turn On Time (ton):

115 ns

Trade Compliance

FDD7N60NZ Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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