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FDD7030BL

Onsemi

FDD7030BL by Onsemi

FDD7030BL by Onsemi is a N-CHANNEL Power FET with 30V DS Breakdown Voltage, 100A IDM, and 0.0095 ohm RDS. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 60W. Suitable for surface mount installation, it has a GULL WING terminal form and RECTANGULAR package shape.

Median Price

$0.534

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,500 parts In-Stock

1+ parts

$1.020

100+ parts

$0.414

1k+ parts

$0.287

10k+ parts

$0.223

2,500

$1.020

$0.414

$0.287

$0.223

Rochester

USA . 80,423 parts In-Stock

1+ parts

-

100+ parts

$0.515

1k+ parts

$0.428

10k+ parts

$0.381

80,423

-

$0.515

$0.428

$0.381

Verical

USA . 62,905 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.534

10k+ parts

$0.476

62,905

-

-

$0.534

$0.476

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,366 parts In-Stock

1+ parts

$0.355

100+ parts

-

1k+ parts

-

10k+ parts

-

1,366

$0.355

-

-

-

Digiode

USA . 2,481 parts In-Stock

1+ parts

$0.401

100+ parts

-

1k+ parts

-

10k+ parts

-

2,481

$0.401

-

-

-

DigiKey Marketplace

USA . 80,423 parts In-Stock

1+ parts

-

100+ parts

$0.440

1k+ parts

-

10k+ parts

-

80,423

-

$0.440

-

-

Fibra_Brandt Electronic GMBH

Germany . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 443 parts In-Stock

1+ parts

$0.355

100+ parts

-

1k+ parts

-

10k+ parts

-

443

$0.355

-

-

-

Corphita

USA . 1,602 parts In-Stock

1+ parts

$0.380

100+ parts

-

1k+ parts

-

10k+ parts

-

1,602

$0.380

-

-

-

Native Components

USA . 932 parts In-Stock

1+ parts

$124.730

100+ parts

-

1k+ parts

-

10k+ parts

$119.741

932

$124.730

-

-

$119.741

Northwest PG Solutions

USA . 2,074 parts In-Stock

1+ parts

$137.203

100+ parts

-

1k+ parts

-

10k+ parts

-

2,074

$137.203

-

-

-

Continental Prestige Electronics

USA . 80,423 parts In-Stock

1+ parts

-

100+ parts

$0.510

1k+ parts

-

10k+ parts

-

80,423

-

$0.510

-

-

Metaverse IC Inc.

Canada . 80,423 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

80,423

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-

-

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Kepictronics

USA . 27,860 parts In-Stock

1+ parts

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100+ parts

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27,860

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-

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

1+ parts

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100+ parts

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25,000

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QUARKTWIN TECHNOLOGY LTD

USA . 5,920 parts In-Stock

1+ parts

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100+ parts

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5,920

-

-

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A-Z Elektronik GmbH

Germany . 5,250 parts In-Stock

1+ parts

-

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-

1k+ parts

-

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5,250

-

-

-

-

Supply Digital

USA . 2,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,880

-

-

-

-

TANS Electronics

Latvia . 1,925 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,925

-

-

-

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Kulean Microsystems

USA . 1,152 parts In-Stock

1+ parts

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100+ parts

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1,152

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-

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Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1,000

-

-

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UHIMA Technologies

Türkiye . 813 parts In-Stock

1+ parts

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100+ parts

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813

-

-

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Problanco Electronics

Mexico . 166 parts In-Stock

1+ parts

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166

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SupplyDigital Components

Austria . 118 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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118

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Overview

Unleash the power of innovation with the FDD7030BL by Onsemi, a top-quality Power Field Effect Transistor (FET) designed for switching applications. With its N-Channel configuration and built-in diode, this transistor offers unparalleled performance and reliability. Whether you're looking to enhance your electronic projects or upgrade your systems, this product delivers exceptional value with a maximum operating temperature of 175 °C, making it ideal for a wide range of applications. Trust in Onsemi's expertise and invest in the FDD7030BL for superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides good insulation and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics and lower on-resistance compared to P-channel FETs, making them suitable for various applications.

Maximum Pulsed Drain Current (IDM): 100 A

The high maximum pulsed drain current allows for efficient switching and handling of high current loads.

Maximum Power Dissipation (Abs): 60 W

With a high power dissipation rating, this FET can handle high power applications without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers low on-resistance and high switching speeds, making it ideal for switching applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows for reliable performance in high temperature environments.

Maximum Drain-Source On Resistance: 0.0095 ohm

Low on-resistance in the drain-source channel minimizes power loss and improves efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) FDD7030BL attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

174 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

56 A

Maximum Drain Current (ID):

21 A

Maximum Drain-Source On Resistance:

.0095 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

100 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

73 ns

Maximum Turn On Time (ton):

38 ns

Trade Compliance

FDD7030BL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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