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FDD770N15A

Onsemi

FDD770N15A by Onsemi

FDD770N15A by Onsemi is a N-CHANNEL Power FET with 150V DS Breakdown Voltage and 36A IDM. Ideal for SWITCHING applications, it features a built-in DIODE, 0.077 ohm Drain-Source Resistance, and operates in ENHANCEMENT MODE.

Median Price

$0.712

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3,013 parts In-Stock

1+ parts

$0.505

100+ parts

$0.482

1k+ parts

$0.459

10k+ parts

$0.452

3,013

$0.505

$0.482

$0.459

$0.452

Newark

USA . 1,835 parts In-Stock

1+ parts

$1.850

100+ parts

$0.888

1k+ parts

$0.688

10k+ parts

-

1,835

$1.850

$0.888

$0.688

-

DigiKey

USA . 3,986 parts In-Stock

1+ parts

$1.870

100+ parts

$0.795

1k+ parts

$0.573

10k+ parts

$0.435

3,986

$1.870

$0.795

$0.573

$0.435

Mouser Electronics

USA . 6,871 parts In-Stock

1+ parts

$2.010

100+ parts

$0.832

1k+ parts

$0.586

10k+ parts

$0.497

6,871

$2.010

$0.832

$0.586

$0.497

Farnell

UK . 7,290 parts In-Stock

1+ parts

-

100+ parts

$0.711

1k+ parts

$0.491

10k+ parts

$0.460

7,290

-

$0.711

$0.491

$0.460

Element14

Singapore . 7,290 parts In-Stock

1+ parts

-

100+ parts

$0.713

1k+ parts

$0.492

10k+ parts

$0.462

7,290

-

$0.713

$0.492

$0.462

Verical

USA . 3,013 parts In-Stock

1+ parts

-

100+ parts

$0.482

1k+ parts

$0.459

10k+ parts

$0.452

3,013

-

$0.482

$0.459

$0.452

Future Electronics

Canada . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.735

2,500

-

-

-

$0.735

Rochester

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$0.562

1k+ parts

$0.467

10k+ parts

$0.416

500

-

$0.562

$0.467

$0.416

Chip1Stop

Japan . 270 parts In-Stock

1+ parts

-

100+ parts

$0.496

1k+ parts

$0.431

10k+ parts

-

270

-

$0.496

$0.431

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 648 parts In-Stock

1+ parts

$0.437

100+ parts

-

1k+ parts

-

10k+ parts

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648

$0.437

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.825

100+ parts

-

1k+ parts

-

10k+ parts

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100

$0.825

-

-

-

TME

Poland . 2,500 parts In-Stock

1+ parts

$1.190

100+ parts

$0.692

1k+ parts

$0.579

10k+ parts

-

2,500

$1.190

$0.692

$0.579

-

IBS Electronics

USA . 67,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.052

67,500

-

-

-

$1.052

Vyrian

USA . 5,048 parts In-Stock

1+ parts

-

100+ parts

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5,048

-

-

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Flip Electronics

USA . 5,000 parts In-Stock

1+ parts

-

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5,000

-

-

-

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NAC Semi

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$1.450

5,000

-

-

-

$1.450

Sensible Micro Corp

USA . 2,120 parts In-Stock

1+ parts

-

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2,120

-

-

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Cyclops Electronics Ltd

UK . 966 parts In-Stock

1+ parts

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966

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ComSIT Distribution GmbH

Germany . 398 parts In-Stock

1+ parts

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100+ parts

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398

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Fibra_Brandt Electronic GMBH

Germany . 4 parts In-Stock

1+ parts

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-

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,729 parts In-Stock

1+ parts

$0.361

100+ parts

-

1k+ parts

-

10k+ parts

-

4,729

$0.361

-

-

-

Semicontronic

India . 4,512 parts In-Stock

1+ parts

$0.361

100+ parts

$0.352

1k+ parts

$0.350

10k+ parts

-

4,512

$0.361

$0.352

$0.350

-

Corphita

USA . 2,397 parts In-Stock

1+ parts

$0.414

100+ parts

-

1k+ parts

-

10k+ parts

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2,397

$0.414

-

-

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Corohmni

South Africa . 315 parts In-Stock

1+ parts

$0.425

100+ parts

-

1k+ parts

-

10k+ parts

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315

$0.425

-

-

-

Component Stockers USA

USA . 16,823 parts In-Stock

1+ parts

$0.470

100+ parts

$0.440

1k+ parts

$0.410

10k+ parts

-

16,823

$0.470

$0.440

$0.410

-

Argo Parts USA

USA . 434 parts In-Stock

1+ parts

$0.538

100+ parts

-

1k+ parts

-

10k+ parts

$0.522

434

$0.538

-

-

$0.522

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.825

100+ parts

-

1k+ parts

$0.784

10k+ parts

$0.767

100

$0.825

-

$0.784

$0.767

Continental Prestige Electronics

USA . 13,912 parts In-Stock

1+ parts

$1.070

100+ parts

$0.644

1k+ parts

$0.426

10k+ parts

$0.377

13,912

$1.070

$0.644

$0.426

$0.377

Aztec Data Supply Inc.

USA . 2,455 parts In-Stock

1+ parts

$1.100

100+ parts

-

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-

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2,455

$1.100

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Kepictronics

USA . 45,000 parts In-Stock

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45,000

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Perfect Parts

USA . 33,648 parts In-Stock

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33,648

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Lixinc

USA . 15,766 parts In-Stock

1+ parts

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100+ parts

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15,766

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TANS Electronics

Latvia . 8,136 parts In-Stock

1+ parts

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8,136

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-

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SupplyDigital Components

Austria . 5,505 parts In-Stock

1+ parts

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5,505

-

-

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Problanco Electronics

Mexico . 3,698 parts In-Stock

1+ parts

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100+ parts

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3,698

-

-

-

-

Kulean Microsystems

USA . 1,052 parts In-Stock

1+ parts

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100+ parts

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1,052

-

-

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Supply Digital

USA . 525 parts In-Stock

1+ parts

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525

-

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UHIMA Technologies

Türkiye . 80 parts In-Stock

1+ parts

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100+ parts

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80

-

-

-

-

Overview

Discover the power of innovation with the FDD770N15A by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) that are perfect for various switching applications. With a focus on enhancing performance and efficiency, this N-CHANNEL transistor offers customers a reliable solution with a built-in diode for added convenience. Embrace the future of technology with Onsemi and experience the value and benefits of the FDD770N15A for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the FET, making it a reliable choice.

Polarity or Channel Type: N-CHANNEL

Offers efficient current control and low power consumption, ideal for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space, enhancing overall functionality.

Transistor Application: SWITCHING

Enables fast switching speeds and high efficiency, making it suitable for power applications.

Surface Mount: YES

Allows for easy installation and space-saving on PCBs, optimizing design flexibility.

Minimum DS Breakdown Voltage: 150 V

Provides high voltage tolerance, ensuring the FET can handle demanding operating conditions.

Package Shape: RECTANGULAR

Facilitates compact and efficient PCB layout, enhancing overall system integration.

Terminal Form: GULL WING

Facilitates easy soldering and ensures reliable electrical connections for improved performance.

Operating Mode: ENHANCEMENT MODE

Enhances control over the FET's operation, leading to increased efficiency and performance.

Maximum Pulsed Drain Current (IDM): 36 A

Handles high current loads for short durations, making it suitable for peak power demands.

Avalanche Energy Rating (EAS): 31.7 mJ

Provides protection against voltage spikes and surges, increasing the FET's durability.

Maximum Drain Current (Abs) (ID): 18 A

Offers sufficient current-handling capability for various applications, ensuring reliable operation.

No. of Terminals: 2

Simplifies connections and reduces complexity, making it user-friendly for installation.

Maximum Power Dissipation (Abs): 56.8 W

Handles high power levels efficiently, suitable for demanding power applications.

Package Style (Meter): SMALL OUTLINE

Saves space on the PCB and allows for compact designs, optimizing system size.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides high performance and reliability, making it a trusted choice for power applications.

Maximum Operating Temperature: 150 °C

Withstands high temperatures, ensuring reliable operation in various environments.

Transistor Element Material: SILICON

Offers excellent electrical properties and reliability, ensuring long-term performance.

Terminal Finish: MATTE TIN

Enhances solderability and ensures stable electrical connections, increasing overall reliability.

Maximum Drain-Source On Resistance: 0.077 ohm

Low On resistance ensures efficient power handling and minimal power loss.

Terminal Position: SINGLE

Simplifies circuit design and installation, making it user-friendly for various applications.

Case Connection: DRAIN

Allows for convenient connection and efficient dissipation of heat, improving overall performance.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reliability during assembly, enhancing product quality.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering processes, ensuring reliable connection and performance.

Technical Specifications

Power Field Effect Transistors (FET) FDD770N15A attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

31.7 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (Abs) (ID):

18 A

Maximum Drain Current (ID):

18 A

Maximum Drain-Source On Resistance:

.077 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

36 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDD770N15A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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