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FDD5N50TM

Onsemi

FDD5N50TM by Onsemi

FDD5N50TM by Onsemi is a N-CHANNEL Power FET with 500V DS Breakdown Voltage. Ideal for SWITCHING applications, it features 16A IDM and 1.4 ohm RDS(on). The transistor operates in ENHANCEMENT MODE with a max temp of 150 °C, making it suitable for various power control systems.

Median Price

$0.383

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,984 parts In-Stock

1+ parts

-

100+ parts

$0.383

1k+ parts

$0.318

10k+ parts

$0.283

2,984

-

$0.383

$0.318

$0.283

DigiKey

USA . 2,984 parts In-Stock

1+ parts

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1k+ parts

$0.330

10k+ parts

-

2,984

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$0.330

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Verical

USA . 2,744 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.398

10k+ parts

$0.354

2,744

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-

$0.398

$0.354

Distributors (In-Stock)

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Digiode

USA . 2,486 parts In-Stock

1+ parts

$0.298

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2,486

$0.298

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Vyrian

USA . 2,532 parts In-Stock

1+ parts

$0.314

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2,532

$0.314

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Bristol Electronics

USA . 1,218 parts In-Stock

1+ parts

$0.938

100+ parts

$0.375

1k+ parts

$0.263

10k+ parts

$0.244

1,218

$0.938

$0.375

$0.263

$0.244

DigiKey Marketplace

USA . 2,984 parts In-Stock

1+ parts

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2,984

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ACDS - Activité Composants Distribution Service

France . 1,218 parts In-Stock

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1,218

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Dan-Mar Components

USA . 1,218 parts In-Stock

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1,218

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,864 parts In-Stock

1+ parts

$0.283

100+ parts

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1,864

$0.283

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Corohmni

South Africa . 400 parts In-Stock

1+ parts

$0.314

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400

$0.314

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Northwest PG Solutions

USA . 1,931 parts In-Stock

1+ parts

$2.451

100+ parts

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1,931

$2.451

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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25,000

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SupplyDigital Components

Austria . 5,767 parts In-Stock

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Problanco Electronics

Mexico . 3,910 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,782 parts In-Stock

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3,782

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Kulean Microsystems

USA . 3,466 parts In-Stock

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TANS Electronics

Latvia . 3,111 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Continental Prestige Electronics

USA . 2,984 parts In-Stock

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$0.380

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2,984

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Supply Digital

USA . 2,401 parts In-Stock

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Infinite Electronics LLP (Excess)

. 2,182 parts In-Stock

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2,182

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Native Components

USA . 683 parts In-Stock

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$2.162

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683

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$2.162

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Perfect Parts

USA . 672 parts In-Stock

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672

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UHIMA Technologies

Türkiye . 651 parts In-Stock

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Overview

Enhance your power management solutions with the FDD5N50TM by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) known for their reliability and efficiency. This N-CHANNEL transistor is designed for switching applications, offering a maximum DS Breakdown Voltage of 500V and a Maximum Pulsed Drain Current of 16A. With its small outline package style and built-in diode, this transistor provides superior performance while operating in enhancement mode. Trust Onsemi's FDD5N50TM to meet your power needs with precision and ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the transistor lightweight and durable, which is ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics compared to P-channel FETs, making this transistor a good choice for many circuit designs.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies the design and wiring process, saving time and effort for the user.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers high efficiency and fast response times when turning on and off.

Surface Mount: YES

With surface mount capability, this transistor is easy to solder onto circuit boards, making it suitable for compact and dense PCB designs.

Minimum DS Breakdown Voltage: 500 V

The high breakdown voltage allows this transistor to operate reliably in high voltage applications, providing a safety margin for the circuit.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy placement and mounting on PCBs, optimizing space utilization.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and ease of soldering, ensuring reliable electrical connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over switching operations and lower power consumption, making this transistor efficient in various applications.

Maximum Pulsed Drain Current (IDM): 16 A

The high pulsed drain current rating allows this transistor to handle peak current loads efficiently, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 256 mJ

The high avalanche energy rating ensures the transistor can withstand voltage spikes and transient events, increasing its reliability and durability.

No. of Terminals: 2

With only 2 terminals, this transistor is easy to use and integrate into circuit designs, reducing complexity and potential points of failure.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for high-density mounting, making this transistor suitable for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology offers high performance, low power consumption, and reliability, making this transistor a good choice for various applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can withstand high-temperature environments, ensuring reliable operation under extreme conditions.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor elements, providing good performance characteristics and stability in various operating conditions.

Maximum Drain Current (ID): 4 A

The high maximum drain current rating allows this transistor to handle current loads effectively, making it suitable for various power circuit designs.

Maximum Drain-Source On Resistance: 1.4 ohm

The low drain-source on resistance ensures efficient power transfer and minimal power loss in the transistor, enhancing overall circuit performance.

Terminal Position: SINGLE

Having a single terminal position simplifies the installation and connection process, reducing the chance of errors and improving overall reliability.

Case Connection: DRAIN

The drain case connection offers good thermal dissipation and allows for efficient heat transfer, ensuring the transistor can operate reliably under high-power conditions.

Technical Specifications

Power Field Effect Transistors (FET) FDD5N50TM attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

256 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (ID):

4 A

Maximum Drain-Source On Resistance:

1.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

16 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDD5N50TM Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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