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FDD5612

Onsemi

FDD5612 by Onsemi

FDD5612 by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage and 100A IDM. Ideal for SWITCHING applications, it features a built-in DIODE, 0.055 ohm RDS(on), and operates in ENHANCEMENT MODE.

Median Price

$0.444

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,800 parts In-Stock

1+ parts

$0.444

100+ parts

$0.417

1k+ parts

$0.377

10k+ parts

-

6,800

$0.444

$0.417

$0.377

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,952 parts In-Stock

1+ parts

$0.422

100+ parts

-

1k+ parts

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1,952

$0.422

-

-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.793

100+ parts

-

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10

$0.793

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Chip Stock

USA . 11,500 parts In-Stock

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11,500

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Vyrian

USA . 6,728 parts In-Stock

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6,728

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Bristol Electronics

USA . 2,496 parts In-Stock

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2,496

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Distributors (Availability)

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Ampacity Inc.

Singapore . 6,536 parts In-Stock

1+ parts

$0.377

100+ parts

-

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6,536

$0.377

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Semicontronic

India . 6,374 parts In-Stock

1+ parts

$0.377

100+ parts

$0.368

1k+ parts

$0.366

10k+ parts

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6,374

$0.377

$0.368

$0.366

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Corphita

USA . 1,464 parts In-Stock

1+ parts

$0.400

100+ parts

-

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1,464

$0.400

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Corohmni

South Africa . 253 parts In-Stock

1+ parts

$0.444

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253

$0.444

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$0.679

100+ parts

$0.624

1k+ parts

$0.585

10k+ parts

-

5,000

$0.679

$0.624

$0.585

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Aztec Data Supply Inc.

USA . 2,682 parts In-Stock

1+ parts

$0.780

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2,682

$0.780

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Continental Prestige Electronics

USA . 2,259 parts In-Stock

1+ parts

$0.793

100+ parts

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$0.777

2,259

$0.793

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-

$0.777

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.793

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2,000

$0.793

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Argo Parts USA

USA . 1,904 parts In-Stock

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$0.793

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1,904

$0.793

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Kepictronics

USA . 27,860 parts In-Stock

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27,860

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Problanco Electronics

Mexico . 5,930 parts In-Stock

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5,930

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Kulean Microsystems

USA . 5,786 parts In-Stock

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5,786

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Lixinc

USA . 3,809 parts In-Stock

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SupplyDigital Components

Austria . 3,092 parts In-Stock

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3,092

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Futuretech Components

Singapore . 2,500 parts In-Stock

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Supply Digital

USA . 2,004 parts In-Stock

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Assy Fe

Spain . 1,349 parts In-Stock

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1,349

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TANS Electronics

Latvia . 1,110 parts In-Stock

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UHIMA Technologies

Türkiye . 748 parts In-Stock

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748

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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iodParts Technologies Inc.

India . 12 parts In-Stock

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12

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Overview

Looking for a reliable and efficient Power Field Effect Transistor (FET)? Look no further than the FDD5612 by Onsemi. With a reputation for quality and innovation, Onsemi delivers cutting-edge technology that exceeds expectations. This N-CHANNEL transistor is perfect for switching applications and comes with a built-in diode for added convenience. Offering a maximum drain current of 18A and a low on-resistance of 0.055 ohm, the FDD5612 provides exceptional value and performance. Trust Onsemi to power up your next project with this top-of-the-line FET.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components, ensuring longevity and reliability.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow in one direction, suitable for various switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplified design with integrated diode for reverse current protection, enhancing overall performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient operation.

Surface Mount: YES

Enables easy and convenient installation on circuit boards, saving space and enhancing productivity.

Minimum DS Breakdown Voltage: 60 V

Withstands high voltages, making it suitable for a wide range of applications that require voltage protection.

Maximum Pulsed Drain Current (IDM): 100 A

Capable of handling high current loads during short pulses, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 36 W

Efficiently dissipates heat, ensuring stable performance under high power conditions.

Maximum Operating Temperature: 175 °C

Operates reliably at high temperatures, suitable for industrial and automotive applications.

Maximum Drain-Source On Resistance: 0.055 ohm

Low on-resistance reduces power loss and improves efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) FDD5612 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

90 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

19 A

Maximum Drain Current (ID):

18 A

Maximum Drain-Source On Resistance:

.055 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

100 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDD5612 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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