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FDB045AN08A0-F085

Onsemi

FDB045AN08A0-F085 by Onsemi

FDB045AN08A0-F085 by Onsemi is a N-CHANNEL Power FET with 75V DS Breakdown Voltage, ideal for SWITCHING applications. It features 19A Drain Current, 0.0045 ohm On Resistance, and 310W Power Dissipation in a RECTANGULAR package. Operating at up to 175°C, it uses METAL-OXIDE SEMICONDUCTOR technology for high performance.

Median Price

$2.214

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,232 parts In-Stock

1+ parts

-

100+ parts

$2.090

1k+ parts

$1.870

10k+ parts

$1.760

2,232

-

$2.090

$1.870

$1.760

Verical

USA . 1,406 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.337

10k+ parts

$2.200

1,406

-

-

$2.337

$2.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,390 parts In-Stock

1+ parts

$2.214

100+ parts

-

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2,390

$2.214

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Nova Conductors

Japan . 929 parts In-Stock

1+ parts

$2.722

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-

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929

$2.722

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Vyrian

USA . 2,565 parts In-Stock

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2,565

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Flip Electronics

USA . 800 parts In-Stock

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800

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J2 Sourcing AB

Sweden . 391 parts In-Stock

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391

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,977 parts In-Stock

1+ parts

$1.980

100+ parts

-

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1,977

$1.980

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Corphita

USA . 2,793 parts In-Stock

1+ parts

$2.097

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2,793

$2.097

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Corohmni

South Africa . 465 parts In-Stock

1+ parts

$2.330

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465

$2.330

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$2.668

100+ parts

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$2.561

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1,000

$2.668

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$2.561

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AZTECH Wire

Italy . 1,141 parts In-Stock

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$17.460

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1,141

$17.460

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Microchip USA

USA . 7,975 parts In-Stock

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$19.205

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7,975

$19.205

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SupplyDigital Components

Austria . 5,779 parts In-Stock

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5,779

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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TANS Electronics

Latvia . 2,713 parts In-Stock

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Kulean Microsystems

USA . 2,543 parts In-Stock

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2,543

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Perfect Parts

USA . 2,365 parts In-Stock

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Problanco Electronics

Mexico . 2,261 parts In-Stock

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2,261

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

$2.668

1k+ parts

$2.586

10k+ parts

$2.532

2,000

-

$2.668

$2.586

$2.532

Supply Digital

USA . 1,880 parts In-Stock

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1,880

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UHIMA Technologies

Türkiye . 750 parts In-Stock

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750

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Overview

Enhance your electronic devices with the high-quality FDB045AN08A0-F085 Power Field Effect Transistor by Onsemi. Designed for switching applications, this N-channel transistor offers a maximum drain current of 19A and a low on-resistance of 0.0045 ohm, ensuring optimal performance. With a robust construction and a small outline package style, this transistor is ideal for a wide range of applications. Trust in Onsemi's reputation for reliability and innovation, and experience the value and efficiency that the FDB045AN08A0-F085 brings to your projects. Elevate your designs with this cutting-edge component today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL configuration allows for efficient switching and control of current flow, making it ideal for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and improves overall efficiency of the system, making it a convenient option for users.

Transistor Application: SWITCHING

Designed for switching applications, this FET provides fast and reliable switching operation for increased performance.

Maximum Drain Current (Abs) (ID): 19 A

With a high maximum drain current rating of 19 A, this FET can handle heavy loads and provide reliable performance under high current conditions.

Maximum Power Dissipation (Abs): 310 W

The high power dissipation capability of 310 W ensures that the FET can handle high power levels without overheating, making it a dependable choice for power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The use of metal-oxide semiconductor technology provides low on-resistance and high switching speeds, making this FET efficient and reliable for power applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature of 175 °C, this FET can withstand elevated temperatures without compromising performance, ensuring long-term reliability.

Technical Specifications

Power Field Effect Transistors (FET) FDB045AN08A0-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

600 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

75 V

Maximum Drain Current (Abs) (ID):

19 A

Maximum Drain Current (ID):

19 A

Maximum Drain-Source On Resistance:

.0045 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDB045AN08A0-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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