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FDB024N04AL7

Onsemi

FDB024N04AL7 by Onsemi

FDB024N04AL7 by Onsemi is a power field effect transistor (FET) with a min DS breakdown voltage of 40V. It is an N-channel transistor with a max drain current of 100A and a max drain-source on resistance of 0.0024 ohm. This transistor is commonly used for switching applications.

Median Price

$2.763

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 30,127 parts In-Stock

1+ parts

-

100+ parts

$2.470

1k+ parts

$2.210

10k+ parts

$2.080

30,127

-

$2.470

$2.210

$2.080

DigiKey

USA . 29,849 parts In-Stock

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$3.250

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29,849

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$3.250

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Verical

USA . 29,359 parts In-Stock

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$2.763

10k+ parts

$2.600

29,359

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$2.763

$2.600

Flip Electronics (Authorized)

USA . 3,200 parts In-Stock

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3,200

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Distributors (In-Stock)

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Digiode

USA . 2,177 parts In-Stock

1+ parts

$2.622

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2,177

$2.622

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Nova Conductors

Japan . 450 parts In-Stock

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$2.801

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450

$2.801

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DigiKey Marketplace

USA . 30,227 parts In-Stock

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30,227

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Vyrian

USA . 16,347 parts In-Stock

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16,347

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Flip Electronics

USA . 3,200 parts In-Stock

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3,200

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ACDS - Activité Composants Distribution Service

France . 789 parts In-Stock

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789

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Bristol Electronics

USA . 789 parts In-Stock

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100+ parts

$2.258

1k+ parts

$1.984

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789

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$2.258

$1.984

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Dan-Mar Components

USA . 789 parts In-Stock

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789

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 20 parts In-Stock

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20

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 263 parts In-Stock

1+ parts

$0.496

100+ parts

-

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263

$0.496

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Ampacity Inc.

Singapore . 16,605 parts In-Stock

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$2.350

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16,605

$2.350

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Corphita

USA . 2,654 parts In-Stock

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$2.484

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2,654

$2.484

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Corohmni

South Africa . 252 parts In-Stock

1+ parts

$2.690

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252

$2.690

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Component Stockers USA

USA . 22,130 parts In-Stock

1+ parts

$2.800

100+ parts

$2.640

1k+ parts

$2.380

10k+ parts

$2.380

22,130

$2.800

$2.640

$2.380

$2.380

Argo Parts USA

USA . 842 parts In-Stock

1+ parts

$2.801

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842

$2.801

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Continental Prestige Electronics

USA . 141 parts In-Stock

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$2.801

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$2.745

141

$2.801

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$2.745

Microchip USA

USA . 132 parts In-Stock

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$20.393

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132

$20.393

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kulean Microsystems

USA . 7,494 parts In-Stock

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7,494

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A-Z Elektronik GmbH

Germany . 6,081 parts In-Stock

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Problanco Electronics

Mexico . 4,832 parts In-Stock

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TANS Electronics

Latvia . 4,155 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,054 parts In-Stock

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4,054

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Supply Digital

USA . 2,771 parts In-Stock

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2,771

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SupplyDigital Components

Austria . 2,074 parts In-Stock

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2,074

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Perfect Parts

USA . 1,574 parts In-Stock

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1,574

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UHIMA Technologies

Türkiye . 920 parts In-Stock

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920

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Kepictronics

USA . 800 parts In-Stock

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800

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Netroflash

USA . 100 parts In-Stock

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$2.745

1k+ parts

$2.661

10k+ parts

$2.605

100

-

$2.745

$2.661

$2.605

Overview

Experience unparalleled power and efficiency with the FDB024N04AL7 by Onsemi. As a trusted manufacturer in the industry, Onsemi brings cutting-edge technology and superior quality to every product they create. This power field effect transistor (FET) is perfect for switching applications, offering enhanced performance and reliability. With its N-channel configuration and built-in diode, this transistor delivers exceptional functionality. Designed for surface mount installation, it provides seamless integration and convenience. Unlock the full potential of your power applications with the FDB024N04AL7, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors are known for their high efficiency and low on-resistance, making this product suitable for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and protection against reverse voltage spikes.

Transistor Application: SWITCHING

Designed for switching applications, this FET can efficiently control the flow of power in circuits.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB designs, saving space and reducing assembly costs.

Minimum DS Breakdown Voltage: 40 V

With a high breakdown voltage, this FET can handle higher voltages without risk of damage.

Maximum Pulsed Drain Current (IDM): 876 A

The high pulsed drain current rating makes this FET suitable for applications with high current pulses.

Maximum Power Dissipation (Abs): 214 W

This FET can handle high power dissipation, making it suitable for high-power applications without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology provides high switching speeds and low on-resistance, enhancing the overall performance of this FET.

Maximum Operating Temperature: 175 °C

The high operating temperature rating allows this FET to operate reliably in a wide range of environmental conditions.

Technical Specifications

Power Field Effect Transistors (FET) FDB024N04AL7 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

864 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

219 A

Maximum Drain Current (ID):

100 A

Maximum Drain-Source On Resistance:

.0024 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

876 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDB024N04AL7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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