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FCPF9N60NT

Onsemi

FCPF9N60NT by Onsemi

FCPF9N60NT by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. It has a max IDM of 27A and EAS of 135mJ, suitable for SWITCHING applications. Operating in ENHANCEMENT MODE, it offers 0.385 ohm RDS(on) and can handle up to 29.8W power dissipation at temperatures ranging from -55 to 150 °C.

Median Price

$1.458

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 2,650 parts In-Stock

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$2.170

100+ parts

$1.430

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$1.180

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$1.040

2,650

$2.170

$1.430

$1.180

$1.040

Rochester

USA . 12,980 parts In-Stock

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-

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$1.200

1k+ parts

$1.070

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$1.010

12,980

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$1.200

$1.070

$1.010

Verical

USA . 7,000 parts In-Stock

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$1.337

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$1.262

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$1.337

$1.262

Flip Electronics (Authorized)

USA . 2,812 parts In-Stock

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DigiKey

USA . 1,700 parts In-Stock

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$1.580

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Distributors (In-Stock)

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Digiode

USA . 2,425 parts In-Stock

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$1.264

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Vyrian

USA . 2,121 parts In-Stock

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$1.330

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$1.330

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Flip Electronics

USA . 2,812 parts In-Stock

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2,812

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DigiKey Marketplace

USA . 2,000 parts In-Stock

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2,000

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Pegasus Components GmbH

Germany . 2,000 parts In-Stock

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R&J Components

USA . 958 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 550 parts In-Stock

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Bristol Electronics

USA . 550 parts In-Stock

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$1.174

1k+ parts

$0.963

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550

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$1.174

$0.963

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Dan-Mar Components

USA . 550 parts In-Stock

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550

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Distributors (Availability)

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Native Components

USA . 928 parts In-Stock

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$0.126

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$0.121

928

$0.126

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$0.121

Northwest PG Solutions

USA . 1,694 parts In-Stock

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$0.138

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$0.122

1,694

$0.138

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$0.122

Corphita

USA . 972 parts In-Stock

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$1.197

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$1.197

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Corohmni

South Africa . 496 parts In-Stock

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$1.330

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Continental Prestige Electronics

USA . 12,980 parts In-Stock

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$2.170

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$1.430

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$1.180

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$2.170

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Microchip USA

USA . 266 parts In-Stock

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$17.550

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TANS Electronics

Latvia . 8,396 parts In-Stock

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Problanco Electronics

Mexico . 7,288 parts In-Stock

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SupplyDigital Components

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Kulean Microsystems

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A-Z Elektronik GmbH

Germany . 5,250 parts In-Stock

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Perfect Parts

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Component Stockers USA

USA . 1,858 parts In-Stock

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UHIMA Technologies

Türkiye . 655 parts In-Stock

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Supply Digital

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Kepictronics

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Cyclops Electronics Ltd (Excess)

UK . 50 parts In-Stock

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Overview

Unleash the power of the FCPF9N60NT by Onsemi, a top-of-the-line Power Field Effect Transistor that redefines efficiency and reliability in switching applications. Crafted with precision by Onsemi, this N-CHANNEL transistor boasts a built-in diode for seamless operation. With a high DS breakdown voltage of 600V and maximum drain current of 9A, this transistor offers unmatched performance and durability. Whether you're in industrial automation or power management, the FCPF9N60NT delivers exceptional value and benefits, making it the go-to choice for your next project. Experience the difference with Onsemi's cutting-edge technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher electron mobility, making them ideal for high-speed switching applications.

Minimum DS Breakdown Voltage: 600 V

The high breakdown voltage allows for efficient switching and handling of high voltages.

Maximum Pulsed Drain Current (IDM): 27 A

The high pulsed drain current capability makes this FET suitable for handling peak power demands.

Maximum Power Dissipation (Abs): 29.8 W

With a high power dissipation rating, this FET can handle significant power levels without overheating.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows for reliable performance in a variety of environmental conditions.

Technical Specifications

Power Field Effect Transistors (FET) FCPF9N60NT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

135 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

9 A

Maximum Drain Current (ID):

9 A

Maximum Drain-Source On Resistance:

.385 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

27 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCPF9N60NT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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