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FCPF190N65FL1

Onsemi

FCPF190N65FL1 by Onsemi

FCPF190N65FL1 by Onsemi is a N-CHANNEL Power FET with 650V DS Breakdown Voltage. Ideal for SWITCHING applications, it features 61.8A IDM, 400mJ EAS, and 0.19 ohm RDS(on). With a max power dissipation of 39W and operating temperature up to 150 °C, this transistor is suitable for various high-power electronic designs.

Median Price

$1.250

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,000 parts In-Stock

1+ parts

$1.500

100+ parts

$1.410

1k+ parts

$1.280

10k+ parts

-

3,000

$1.500

$1.410

$1.280

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Flip Electronics (Authorized)

USA . 39,390 parts In-Stock

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39,390

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Farnell

UK . 8,000 parts In-Stock

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$1.000

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8,000

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$1.000

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Distributors (In-Stock)

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Vyrian

USA . 614 parts In-Stock

1+ parts

$1.000

100+ parts

-

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614

$1.000

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Digiode

USA . 2,807 parts In-Stock

1+ parts

$1.425

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2,807

$1.425

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Flip Electronics

USA . 16,390 parts In-Stock

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16,390

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Distributors (Availability)

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Corohmni

South Africa . 470 parts In-Stock

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$1.000

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470

$1.000

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Corphita

USA . 2,130 parts In-Stock

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$1.350

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2,130

$1.350

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Component Stockers USA

USA . 9,510 parts In-Stock

1+ parts

$1.440

100+ parts

$1.350

1k+ parts

$1.230

10k+ parts

-

9,510

$1.440

$1.350

$1.230

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Kepictronics

USA . 130,012 parts In-Stock

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130,012

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RC Electronics

USA . 41,334 parts In-Stock

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$1.980

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$1.800

10k+ parts

$1.750

41,334

-

$1.980

$1.800

$1.750

Continental Prestige Electronics

USA . 8,000 parts In-Stock

1+ parts

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$1.000

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8,000

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$1.000

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SupplyDigital Components

Austria . 6,615 parts In-Stock

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6,615

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TANS Electronics

Latvia . 6,060 parts In-Stock

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6,060

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Kulean Microsystems

USA . 3,557 parts In-Stock

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3,557

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Problanco Electronics

Mexico . 2,921 parts In-Stock

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2,921

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Supply Digital

USA . 1,792 parts In-Stock

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1,792

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Northwest PG Solutions

USA . 542 parts In-Stock

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542

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UHIMA Technologies

Türkiye . 394 parts In-Stock

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394

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Native Components

USA . 229 parts In-Stock

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229

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Overview

Experience the superior performance and reliability of the FCPF190N65FL1 Power Field Effect Transistor by Onsemi. With a focus on quality and innovation, Onsemi delivers cutting-edge technology for switching applications. This N-CHANNEL transistor offers enhanced efficiency and power handling capabilities, making it ideal for a wide range of industrial and automotive uses. Trust Onsemi to provide products that exceed expectations and deliver exceptional value to customers looking for top-notch electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package material provides durability and protection for the internal components, making the product suitable for various operating environments.

Minimum DS Breakdown Voltage: 650 V

With a high minimum breakdown voltage, this FET can handle high voltage applications with ease, ensuring reliable performance and safety.

Maximum Pulsed Drain Current (IDM): 61.8 A

The high pulsed drain current rating allows the FET to handle sudden surges in current, making it suitable for applications where peak current levels may be required.

Avalanche Energy Rating (EAS): 400 mJ

The high avalanche energy rating indicates that the FET can withstand energy spikes and transient conditions without failure, ensuring longevity and reliability in harsh operating conditions.

Maximum Power Dissipation (Abs): 39 W

With a high power dissipation rating, this FET can efficiently handle heat dissipation, ensuring optimal performance and longevity under high-power operation.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature rating allows the FET to operate reliably in high-temperature environments without compromising performance, making it ideal for a wide range of applications.

Technical Specifications

Power Field Effect Transistors (FET) FCPF190N65FL1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

400 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

20.6 A

Maximum Drain Current (ID):

20.6 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

61.8 A

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCPF190N65FL1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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