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FCPF13N60NT

Onsemi

FCPF13N60NT by Onsemi

FCPF13N60NT by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. It has a Max IDM of 39A and EAS of 235mJ, ideal for SWITCHING applications. This SINGLE transistor in PLASTIC/EPOXY package operates in ENHANCEMENT MODE up to 150 °C, with 0.258 ohm RDS(on) and 33.8W Pdiss capability.

Median Price

$2.025

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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Rochester

USA . 1,868 parts In-Stock

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$1.810

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$1.620

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$1.530

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$1.530

Verical

USA . 1,133 parts In-Stock

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$2.025

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$1.913

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DigiKey

USA . 580 parts In-Stock

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Master Electronics

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$2.940

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Chip1Stop

Japan . 218 parts In-Stock

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Maritex

Poland . 1,000 parts In-Stock

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$1.374

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$0.787

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$0.666

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$1.374

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Vyrian

USA . 385 parts In-Stock

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$1.740

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Digiode

USA . 2,842 parts In-Stock

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$1.928

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ComSIT Distribution GmbH

Germany . 1,000 parts In-Stock

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Dan-Mar Components

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ACDS - Activité Composants Distribution Service

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Bristol Electronics

USA . 500 parts In-Stock

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$1.254

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$1.102

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Rapid Electronics

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Cyclops Electronics Ltd

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Electronics Depot

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Corohmni

South Africa . 184 parts In-Stock

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Corphita

USA . 1,871 parts In-Stock

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Metaverse IC Inc.

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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SupplyDigital Components

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Kulean Microsystems

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A-Z Elektronik GmbH

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Authorized Procurement Solutions

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Problanco Electronics

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Alle Elektronik GmbH

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Northwest PG Solutions

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Overview

Unleash the power of high-quality FCPF13N60NT Power Field Effect Transistor (FET) by Onsemi for all your switching needs. With its N-CHANNEL polarity, SINGLE configuration with built-in diode, and ENHANCEMENT MODE operation, this transistor is perfect for a wide range of applications. From industrial automation to consumer electronics, this transistor offers exceptional performance and reliability. Trust in Onsemi's reputation for excellence and invest in the FCPF13N60NT for superior power management solutions. Experience the value and benefits that this product brings to your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good mechanical and environmental protection for the transistor.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower RDS(on) values and higher mobility, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for protection against reverse current flow, enhancing the reliability of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient operation in such scenarios.

Maximum Drain-Source On Resistance: 0.258 ohm

Low RDS(on) value indicates minimal conduction losses and high efficiency in switching operations.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without compromising performance, suitable for industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) FCPF13N60NT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

235 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

13 A

Maximum Drain Current (ID):

13 A

Maximum Drain-Source On Resistance:

.258 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

39 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCPF13N60NT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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