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FAN7734MX

Onsemi

FAN7734MX by Onsemi

FAN7734MX by Onsemi is a 16-terminal LED display driver with a max supply current of 6mA and nominal voltage of 20V. Operating in automotive-grade temperatures (-40 to 125 °C), it's ideal for graphics displays, featuring a small outline package style and gull wing terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,264 parts In-Stock

1+ parts

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2,264

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Digiode

USA . 1,533 parts In-Stock

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1,533

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 826 parts In-Stock

1+ parts

$9.315

100+ parts

-

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826

$9.315

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Northwest PG Solutions

USA . 1,709 parts In-Stock

1+ parts

$10.247

100+ parts

$9.222

1k+ parts

-

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1,709

$10.247

$9.222

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Kulean Microsystems

USA . 6,750 parts In-Stock

1+ parts

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6,750

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TANS Electronics

Latvia . 3,720 parts In-Stock

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3,720

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Problanco Electronics

Mexico . 3,465 parts In-Stock

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3,465

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Corphita

USA . 3,072 parts In-Stock

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3,072

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SupplyDigital Components

Austria . 2,176 parts In-Stock

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2,176

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UHIMA Technologies

Türkiye . 886 parts In-Stock

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886

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Supply Digital

USA . 863 parts In-Stock

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863

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Corohmni

South Africa . 82 parts In-Stock

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82

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Overview

Enhance your display graphics with the FAN7734MX by Onsemi, a top-of-the-line LED display driver that offers exceptional quality and reliability. Manufactured by Onsemi, a trusted name in the industry, this product is designed to deliver superior performance in automotive applications. With its small outline package and dual terminal position, the FAN7734MX provides easy installation and efficient operation. Experience the value and benefits of this innovative product, perfect for enhancing visual displays in a variety of settings. Trust Onsemi for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal components of the product, making it suitable for various environments.

Surface Mount: YES

The ability to be surface mounted allows for easy and secure installation on PCBs, saving space and making the product more convenient to use.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand extreme heat conditions without malfunctioning, ensuring reliability in challenging environments.

Nominal Supply Voltage: 20 V

The nominal supply voltage of 20V provides sufficient power for the product to operate efficiently, catering to the power requirements of the display driver.

Minimum fmax: 0.075 MHz

The minimum fmax of 0.075 MHz indicates the high frequency capability of the product, allowing for fast and responsive performance in driving LED displays.

Technical Specifications

Graphics Display Drivers FAN7734MX attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

6 mA

Nominal Supply Voltage:

20 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Minimum fmax:

.075 MHz

Trade Compliance

FAN7734MX Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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