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FAN7311N

Onsemi

FAN7311N by Onsemi

FAN7311N by Onsemi is a 20-terminal graphics display driver with a supply voltage range of 5V to 25.5V. It operates b/w -25 °C to 85°C, making it suitable for commercial extended temperature applications. With a rectangular package style and through-hole terminals, it is ideal for liquid crystal display interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,858 parts In-Stock

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1,858

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Digiode

USA . 1,146 parts In-Stock

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1,146

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 889 parts In-Stock

1+ parts

$2.439

100+ parts

-

1k+ parts

$2.342

10k+ parts

$2.342

889

$2.439

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$2.342

$2.342

Native Components

USA . 267 parts In-Stock

1+ parts

$7.461

100+ parts

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267

$7.461

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Kulean Microsystems

USA . 7,155 parts In-Stock

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7,155

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Problanco Electronics

Mexico . 5,458 parts In-Stock

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5,458

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Supply Digital

USA . 2,666 parts In-Stock

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2,666

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SupplyDigital Components

Austria . 2,397 parts In-Stock

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2,397

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Corphita

USA . 2,140 parts In-Stock

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2,140

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TANS Electronics

Latvia . 2,013 parts In-Stock

1+ parts

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2,013

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Northwest PG Solutions

USA . 1,684 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$7.312

10k+ parts

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1,684

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$7.312

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UHIMA Technologies

Türkiye . 810 parts In-Stock

1+ parts

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810

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Corohmni

South Africa . 439 parts In-Stock

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439

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Microchip USA

USA . 252 parts In-Stock

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252

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Perfect Parts

USA . 222 parts In-Stock

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222

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Overview

Enhance your display with the FAN7311N by Onsemi. Designed for optimal performance, this graphics display driver offers unmatched quality and reliability. With a wide range of applications in the electronics industry, this product is perfect for driving liquid crystal displays with precision and efficiency. Trust in Onsemi's reputation for excellence and experience the superior value and benefits that the FAN7311N brings to your projects. Elevate your designs with this top-of-the-line solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications while ensuring longevity.

Maximum Supply Voltage: 25.5 V

Allows for compatibility with a wide range of power sources, providing flexibility in usage.

No. of Terminals: 20

The high number of terminals allows for complex connections and functionality, making the product versatile and capable of handling multiple inputs/outputs.

Minimum Operating Temperature: -25 °C

The wide operating temperature range ensures the product can function reliably even in extreme cold conditions.

Nominal Supply Voltage: 12 V

Provides a stable and common voltage level for efficient power consumption and performance.

Interface IC Type: LIQUID CRYSTAL DISPLAY DRIVER

The use of LCD driver interface IC ensures smooth and high-quality display output, making the product ideal for graphics applications.

Technical Specifications

Graphics Display Drivers FAN7311N attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PDIP-T20

Length:

28.695 mm

No. of Functions:

1

No. of Segments:

4

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.06 mm

Maximum Supply Voltage:

25.5 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

12 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

FAN7311N Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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