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FAN7318BMX

Onsemi

FAN7318BMX by Onsemi

FAN7318BMX by Onsemi is a Liquid Crystal Display Driver with 20 terminals in a small outline package. It features matte tin terminal finish and dual terminal position, suitable for surface mount applications. The device operates at peak reflow temperature of 260 °C, making it ideal for graphics display drivers.

Median Price

$0.969

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 107,666 parts In-Stock

1+ parts

-

100+ parts

$0.951

1k+ parts

$0.790

10k+ parts

$0.704

107,666

-

$0.951

$0.790

$0.704

Verical

USA . 75,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.987

10k+ parts

$0.880

75,000

-

-

$0.987

$0.880

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,956 parts In-Stock

1+ parts

$0.741

100+ parts

-

1k+ parts

-

10k+ parts

-

1,956

$0.741

-

-

-

Vyrian

USA . 885 parts In-Stock

1+ parts

$0.780

100+ parts

-

1k+ parts

-

10k+ parts

-

885

$0.780

-

-

-

DigiKey Marketplace

USA . 107,666 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

107,666

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,293 parts In-Stock

1+ parts

$0.702

100+ parts

-

1k+ parts

-

10k+ parts

-

1,293

$0.702

-

-

-

Corohmni

South Africa . 411 parts In-Stock

1+ parts

$0.780

100+ parts

-

1k+ parts

-

10k+ parts

-

411

$0.780

-

-

-

Component Stockers USA

USA . 122,040 parts In-Stock

1+ parts

$0.800

100+ parts

$0.750

1k+ parts

$0.680

10k+ parts

$0.680

122,040

$0.800

$0.750

$0.680

$0.680

Native Components

USA . 458 parts In-Stock

1+ parts

$7.900

100+ parts

-

1k+ parts

-

10k+ parts

-

458

$7.900

-

-

-

Northwest PG Solutions

USA . 2,074 parts In-Stock

1+ parts

$8.690

100+ parts

$7.821

1k+ parts

-

10k+ parts

-

2,074

$8.690

$7.821

-

-

TANS Electronics

Latvia . 7,855 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,855

-

-

-

-

SupplyDigital Components

Austria . 6,995 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,995

-

-

-

-

Problanco Electronics

Mexico . 5,038 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,038

-

-

-

-

Supply Digital

USA . 2,145 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,145

-

-

-

-

Kulean Microsystems

USA . 1,839 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,839

-

-

-

-

Microchip USA

USA . 295 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

295

-

-

-

-

UHIMA Technologies

Türkiye . 28 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

28

-

-

-

-

Overview

Enhance your display quality with the FAN7318BMX by Onsemi, a leading manufacturer in graphics display drivers. Designed for superior performance and reliability, this product offers seamless integration and precise control for liquid crystal displays. Perfect for applications in consumer electronics, automotive displays, and industrial equipment, the FAN7318BMX delivers exceptional value and benefits to customers seeking top-notch visual solutions. Experience the advantages of Onsemi's cutting-edge technology and elevate your display experience today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and lightweight design for easier integration into various electronic devices.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and simplifying the manufacturing process.

Package Shape: RECTANGULAR

Rectangular package shape enables efficient use of space on the PCB and allows for multiple drivers to be placed closely together for enhanced functionality.

No. of Terminals: 20

Having 20 terminals provides flexibility in connecting the driver to other components, supporting complex display configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and offers a sleek, modern design for electronic devices.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and corrosion resistance, ensuring long-term reliability of the display driver.

Terminal Position: DUAL

Dual terminal positioning allows for secure connections and better signal transmission, reducing the risk of connection failures.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, the display driver can withstand high-temperature manufacturing processes, ensuring consistent performance.

Terminal Form: GULL WING

The gull wing terminal form offers mechanical strength and ease of soldering, making the installation process efficient and reliable.

Interface IC Type: LIQUID CRYSTAL DISPLAY DRIVER

As a liquid crystal display driver, this product is specifically designed to provide precise control and efficient operation of LCD panels, ensuring high-quality visual output.

Technical Specifications

Graphics Display Drivers FAN7318BMX attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

20

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

FAN7318BMX Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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