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FAN7317BM

Onsemi

FAN7317BM by Onsemi

FAN7317BM by Onsemi is a Liquid Crystal Display Driver with 20 terminals in a small outline package. It features matte tin terminal finish, dual position, and peak reflow temperature of 260 °C. Ideal for graphics display applications requiring surface mount technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,451 parts In-Stock

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1,451

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Vyrian

USA . 1,215 parts In-Stock

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1,215

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Distributors (Availability)

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Native Components

USA . 253 parts In-Stock

1+ parts

$1.015

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253

$1.015

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Northwest PG Solutions

USA . 1,767 parts In-Stock

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$1.116

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1,767

$1.116

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Kulean Microsystems

USA . 7,759 parts In-Stock

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7,759

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TANS Electronics

Latvia . 6,520 parts In-Stock

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6,520

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Problanco Electronics

Mexico . 2,428 parts In-Stock

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2,428

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Supply Digital

USA . 2,401 parts In-Stock

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2,401

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Corphita

USA . 373 parts In-Stock

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373

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Corohmni

South Africa . 366 parts In-Stock

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366

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Microchip USA

USA . 311 parts In-Stock

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311

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SupplyDigital Components

Austria . 287 parts In-Stock

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287

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UHIMA Technologies

Türkiye . 211 parts In-Stock

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211

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Overview

Upgrade your graphics display drivers with the high-quality FAN7317BM by Onsemi. Designed for maximum performance, this product offers exceptional value and benefits to customers in various applications. Onsemi's reputation for excellence ensures that you are getting a reliable and trusted product. Whether you're looking to enhance your LCD displays or improve your graphics performance, the FAN7317BM is the perfect solution for all your needs. Experience the advantages of Onsemi today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components, making this product resistant to wear and tear.

Surface Mount: YES

Surface mount technology allows for easy installation and reduces the overall size of the product, making it ideal for compact electronic devices.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a standardized form factor, making it compatible with a wide range of devices and electronic applications.

No. of Terminals: 20

Having 20 terminals allows for a high level of connectivity and compatibility with various electronic systems, ensuring seamless integration.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces space requirements on the circuit board and provides efficient heat dissipation, enhancing overall performance.

Terminal Finish: Matte Tin (Sn)

Matte Tin terminal finish offers good solderability and corrosion resistance, ensuring stable and reliable connections for the long term.

Terminal Position: DUAL

Dual terminal positions provide flexibility in circuit design and allow for multiple connection options, enabling customization based on specific requirements.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this product ensures efficient soldering processes while safeguarding against overheating.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, this product can withstand high-temperature reflow soldering processes, ensuring robust and reliable performance in various environments.

Terminal Form: GULL WING

Gull wing terminal form provides increased mechanical strength and stability during installation and operation, contributing to the overall durability and longevity of the product.

Interface IC Type: LIQUID CRYSTAL DISPLAY DRIVER

Being a Liquid Crystal Display driver, this product is specifically designed to optimize the performance and resolution of LCD screens, making it an ideal choice for display applications requiring high-quality visuals.

Technical Specifications

Graphics Display Drivers FAN7317BM attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

20

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

FAN7317BM Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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