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FAN7318BM

Onsemi

FAN7318BM by Onsemi

FAN7318BM by Onsemi is a Liquid Crystal Display Driver in a small outline package with 20 terminals. It features matte tin terminal finish, dual position, and gull wing form. Suitable for graphics display applications requiring surface mount technology and peak reflow temperature of 260 °C within 30 seconds.

Median Price

$0.969

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,080 parts In-Stock

1+ parts

-

100+ parts

$0.951

1k+ parts

$0.790

10k+ parts

$0.704

2,080

-

$0.951

$0.790

$0.704

Verical

USA . 2,080 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.987

10k+ parts

$0.880

2,080

-

-

$0.987

$0.880

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,515 parts In-Stock

1+ parts

$0.741

100+ parts

-

1k+ parts

-

10k+ parts

-

2,515

$0.741

-

-

-

Vyrian

USA . 1,424 parts In-Stock

1+ parts

$0.780

100+ parts

-

1k+ parts

-

10k+ parts

-

1,424

$0.780

-

-

-

DigiKey Marketplace

USA . 4,346 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,346

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 86 parts In-Stock

1+ parts

$0.702

100+ parts

-

1k+ parts

-

10k+ parts

-

86

$0.702

-

-

-

Corohmni

South Africa . 165 parts In-Stock

1+ parts

$0.780

100+ parts

-

1k+ parts

-

10k+ parts

-

165

$0.780

-

-

-

Native Components

USA . 456 parts In-Stock

1+ parts

$51.620

100+ parts

-

1k+ parts

-

10k+ parts

$49.556

456

$51.620

-

-

$49.556

Northwest PG Solutions

USA . 2,195 parts In-Stock

1+ parts

$56.782

100+ parts

-

1k+ parts

-

10k+ parts

-

2,195

$56.782

-

-

-

TANS Electronics

Latvia . 4,507 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,507

-

-

-

-

SupplyDigital Components

Austria . 3,022 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,022

-

-

-

-

Kulean Microsystems

USA . 2,501 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,501

-

-

-

-

Supply Digital

USA . 1,655 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,655

-

-

-

-

UHIMA Technologies

Türkiye . 463 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

463

-

-

-

-

Microchip USA

USA . 425 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

425

-

-

-

-

Problanco Electronics

Mexico . 381 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

381

-

-

-

-

Overview

Enhance your display performance with the FAN7318BM by Onsemi, a top-quality graphics display driver designed to optimize your visual experience. With a reputation for excellence, Onsemi delivers superior products that exceed industry standards. Ideal for various applications in the electronics industry, this product offers unmatched value and benefits. Upgrade your devices with the FAN7318BM and enjoy enhanced image quality, improved efficiency, and seamless integration. Trust Onsemi for cutting-edge technology that elevates your user experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body is durable and lightweight, making the product easy to handle and resistant to damage during installation and use.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and simplifying the manufacturing process.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and easily integrated into various electronic devices, making it versatile and compatible with different designs.

No. of Terminals: 20

With 20 terminals, this driver offers ample connectivity options and flexibility for interfacing with other components in the system.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, allowing for compact and efficient designs in electronic devices.

Terminal Finish: Matte Tin (Sn)

The matte tin finish on the terminals provides a reliable and corrosion-resistant connection, ensuring long-term performance and stability.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting options and ease of connection, enhancing the usability and compatibility of the product.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds helps prevent overheating and damage to the product during the soldering process.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, the product can withstand high-temperature reflow processes, ensuring proper soldering and reliability.

Terminal Form: GULL WING

The gull wing terminal form provides a secure and stable connection, reducing the risk of disconnection or malfunction in the system.

Interface IC Type: LIQUID CRYSTAL DISPLAY DRIVER

Designed specifically for interfacing with liquid crystal displays, this driver ensures optimal performance and compatibility with display technologies, making it an ideal choice for graphics applications.

Technical Specifications

Graphics Display Drivers FAN7318BM attributes and parameters. Explore more Graphics Display Drivers devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

20

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

FAN7318BM Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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