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EMH2411R

Onsemi

EMH2411R by Onsemi

The Onsemi EMH2411R is an N-CHANNEL Power FET with 5A max drain current and 1.4W max power dissipation. It operates in enhancement mode with a max temperature of 150 °C, suitable for surface mount applications in various electronic devices.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,772 parts In-Stock

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Vyrian

USA . 1,365 parts In-Stock

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Native Components

USA . 334 parts In-Stock

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$177.843

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$170.729

334

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$170.729

Northwest PG Solutions

USA . 639 parts In-Stock

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$195.628

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Kepictronics

USA . 34,333 parts In-Stock

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SupplyDigital Components

Austria . 4,406 parts In-Stock

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Corphita

USA . 1,345 parts In-Stock

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TANS Electronics

Latvia . 1,311 parts In-Stock

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Problanco Electronics

Mexico . 1,215 parts In-Stock

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UHIMA Technologies

Türkiye . 902 parts In-Stock

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Kulean Microsystems

USA . 445 parts In-Stock

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Corohmni

South Africa . 376 parts In-Stock

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Overview

The EMH2411R by Onsemi is a top-quality N-CHANNEL Power Field Effect Transistor that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this enhancement mode transistor is perfect for a wide range of applications. From power supplies to motor control, this FET delivers superior results with a maximum drain current of 5A and a maximum power dissipation of 1.4W. Trust Onsemi's expertise and invest in the EMH2411R for unparalleled value and benefits in your projects.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used for high power applications due to their low ON-resistance and ability to handle high current.

Surface Mount: YES

Surface mount FETs are easy to mount on a PCB, saving space and making them suitable for compact designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the flow of current, making them ideal for various switching applications.

Maximum Drain Current (Abs) (ID): 5 A

With a high maximum drain current, this FET can handle heavy loads without overheating, making it reliable for high-power circuits.

Maximum Power Dissipation (Abs): 1.4 W

The low power dissipation ensures efficient operation and helps in reducing energy wastage, making it a cost-effective choice.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers fast switching speeds and low ON-resistance, improving overall performance and efficiency of the FET.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows the FET to withstand harsh environments without compromising its performance, ensuring longevity.

Maximum Drain Current (ID): 5 A

The high maximum drain current rating ensures that the FET can handle heavy current loads without getting damaged, making it reliable for demanding applications.

Technical Specifications

Power Field Effect Transistors (FET) EMH2411R attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

EMH2411R Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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