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EMH2411R-TL-H

Onsemi

EMH2411R-TL-H by Onsemi

EMH2411R-TL-H by Onsemi is a N-CHANNEL FET with 5A max drain current and 1.4W power dissipation. Ideal for applications requiring high efficiency in power management systems, it operates at up to 150 °C with surface mount capability.

Median Price

$0.280

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 32,550 parts In-Stock

1+ parts

-

100+ parts

$0.291

1k+ parts

$0.241

10k+ parts

$0.215

32,550

-

$0.291

$0.241

$0.215

Verical

USA . 24,000 parts In-Stock

1+ parts

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$0.269

24,000

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-

-

$0.269

Distributors (In-Stock)

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Digiode

USA . 54 parts In-Stock

1+ parts

$0.226

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54

$0.226

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Vyrian

USA . 5,839 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,975 parts In-Stock

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2,975

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Bristol Electronics

USA . 2,975 parts In-Stock

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2,975

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Dan-Mar Components

USA . 2,975 parts In-Stock

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2,975

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Distributors (Availability)

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Corphita

USA . 90 parts In-Stock

1+ parts

$0.214

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90

$0.214

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Corohmni

South Africa . 222 parts In-Stock

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$0.238

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222

$0.238

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Native Components

USA . 437 parts In-Stock

1+ parts

$0.617

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437

$0.617

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Northwest PG Solutions

USA . 1,212 parts In-Stock

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$0.679

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$0.679

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AZTECH Wire

Italy . 411 parts In-Stock

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$12.750

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411

$12.750

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Continental Prestige Electronics

USA . 32,550 parts In-Stock

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$0.232

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QUARKTWIN TECHNOLOGY LTD

USA . 8,867 parts In-Stock

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Problanco Electronics

Mexico . 7,797 parts In-Stock

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SupplyDigital Components

Austria . 6,158 parts In-Stock

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TANS Electronics

Latvia . 3,061 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Kulean Microsystems

USA . 1,530 parts In-Stock

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UHIMA Technologies

Türkiye . 805 parts In-Stock

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805

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Overview

Experience the power and reliability of the EMH2411R-TL-H N-CHANNEL Power Field Effect Transistor (FET) by Onsemi. With a maximum drain current of 5A and robust metal-oxide semiconductor technology, this surface-mount transistor offers superior performance in a variety of applications. From power supplies to motor control, trust Onsemi's expertise in semiconductor manufacturing to deliver high-quality components that ensure efficiency and longevity. Upgrade your designs with the EMH2411R-TL-H for unparalleled value and peace of mind.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher switching speeds compared to P-channel FETs, making them a preferred choice for many power applications.

Surface Mount: YES

Surface mount FETs are more compact and easier to integrate into PCB designs, allowing for higher component density and improved thermal management.

Maximum Drain Current (Abs) (ID): 5 A

With a maximum drain current of 5A, this FET can handle higher power loads and is suitable for applications requiring higher current ratings.

Maximum Power Dissipation (Abs): 1.4 W

The low power dissipation of 1.4W ensures that the FET operates efficiently and minimizes heat generation, making it suitable for compact designs and high-power density applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers low gate leakage, high input impedance, and improved overall performance, making it ideal for high-speed switching applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand high-temperature environments and is suitable for applications where thermal stability is critical.

Terminal Finish: TIN BISMUTH

The Tin Bismuth terminal finish provides excellent solderability and reliability, ensuring a stable connection in harsh operating conditions and during soldering processes.

Maximum Drain Current (ID): 5 A

The maximum drain current of 5A allows for high current handling capacity and ensures reliable operation under load, making it suitable for various power applications.

Technical Specifications

Power Field Effect Transistors (FET) EMH2411R-TL-H attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Trade Compliance

EMH2411R-TL-H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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