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EMH2409TL

Onsemi

EMH2409TL by Onsemi

The Onsemi EMH2409TL is an N-CHANNEL Power FET with 4A max drain current and 1.2W power dissipation. Ideal for surface mount applications, it operates in enhancement mode at up to 150 °C. Suitable for various electronic devices requiring efficient power management.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,266 parts In-Stock

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Digiode

USA . 1,762 parts In-Stock

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Native Components

USA . 390 parts In-Stock

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$177.843

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$170.729

390

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$170.729

Northwest PG Solutions

USA . 1,304 parts In-Stock

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$195.628

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TANS Electronics

Latvia . 6,465 parts In-Stock

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Problanco Electronics

Mexico . 5,169 parts In-Stock

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Kulean Microsystems

USA . 3,128 parts In-Stock

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Corphita

USA . 2,256 parts In-Stock

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SupplyDigital Components

Austria . 164 parts In-Stock

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Corohmni

South Africa . 150 parts In-Stock

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UHIMA Technologies

Türkiye . 114 parts In-Stock

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Overview

Experience the power and reliability of the EMH2409TL by Onsemi, a top-quality N-CHANNEL Power Field Effect Transistor. Manufactured with cutting-edge METAL-OXIDE SEMICONDUCTOR technology, this enhancement mode transistor offers unmatched performance in a compact surface mount package. Ideal for a variety of applications requiring up to 4A of current, this transistor ensures efficient power management and superior thermal performance. Trust Onsemi for industry-leading products that deliver value and reliability to your projects. Choose the EMH2409TL for all your power transistor needs.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher electron mobility compared to P-channel FETs, making them more efficient for power management applications.

Surface Mount: YES

Being surface mountable allows for easier and more compact integration onto circuit boards, saving space and enabling automated assembly processes.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to use in most applications as they default to a non-conductive state and require a positive voltage to turn on, providing better control and safety.

Maximum Drain Current (Abs) (ID): 4 A

With a maximum drain current of 4A, this FET can handle high current loads, making it suitable for various power applications that require handling significant current levels.

Maximum Power Dissipation (Abs): 1.2 W

With a maximum power dissipation of 1.2W, this FET can effectively dissipate heat generated during operation, ensuring reliability and longevity in high-power scenarios.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide-semiconductor technology offers good switching performance, low gate leakage, and high input impedance, contributing to efficient power handling and reduced power consumption.

Maximum Operating Temperature: 150 °C

The FET's ability to operate at temperatures up to 150 °C ensures reliable performance in demanding environments where heat dissipation is crucial.

Maximum Drain Current (ID): 4 A

With a maximum drain current of 4A, this FET can handle high current loads, making it suitable for various power applications that require handling significant current levels.

Technical Specifications

Power Field Effect Transistors (FET) EMH2409TL attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

EMH2409TL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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