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EMH2412

Onsemi

EMH2412 by Onsemi

The Onsemi EMH2412 is an N-CHANNEL Power FET with 6A max drain current and 1.4W max power dissipation. Ideal for applications requiring high efficiency in a surface-mount package, such as power supplies and motor control systems operating up to 150 °C.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,323 parts In-Stock

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Digiode

USA . 679 parts In-Stock

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Native Components

USA . 441 parts In-Stock

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$5.500

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441

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Kepictronics

USA . 34,226 parts In-Stock

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Problanco Electronics

Mexico . 8,300 parts In-Stock

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Kulean Microsystems

USA . 6,789 parts In-Stock

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TANS Electronics

Latvia . 1,892 parts In-Stock

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SupplyDigital Components

Austria . 1,247 parts In-Stock

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Corphita

USA . 892 parts In-Stock

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Northwest PG Solutions

USA . 819 parts In-Stock

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UHIMA Technologies

Türkiye . 606 parts In-Stock

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Corohmni

South Africa . 75 parts In-Stock

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Overview

Power up your devices with the high-quality EMH2412 N-CHANNEL Power Field Effect Transistor by Onsemi. With a maximum drain current of 6A and maximum power dissipation of 1.4W, this enhancement mode transistor is perfect for a wide range of applications. From power supplies to motor control, the EMH2412 offers reliable performance and efficient operation. Trust in Onsemi's expertise in semiconductor technology to deliver a product that not only meets but exceeds your expectations. Experience the value and benefits of the EMH2412 today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors are known for their high efficiency and fast switching speeds, making this product suitable for applications requiring high performance.

Surface Mount: YES

Surface mount technology allows for easy and compact PCB layout, saving space and simplifying assembly processes.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides better control over the transistor's switching behavior, resulting in more precise and reliable performance.

Maximum Drain Current (Abs): 6 A

With a maximum drain current of 6 A, this FET can handle high power applications, making it suitable for a wide range of power electronics designs.

Maximum Power Dissipation (Abs): 1.4 W

The low power dissipation of 1.4 W ensures efficient operation and helps in minimizing heat generation, promoting long-term reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high electron mobility and low gate leakage, leading to improved performance and energy efficiency.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C allows for reliable operation in demanding environments without compromising performance.

Technical Specifications

Power Field Effect Transistors (FET) EMH2412 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Maximum Drain Current (Abs) (ID):

6 A

Maximum Drain Current (ID):

6 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

EMH2412 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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