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CS8191XNF16

Onsemi

CS8191XNF16 by Onsemi

CS8191XNF16 by Onsemi is a 16V peripheral driver with over-current and over-voltage protection. It operates in industrial temperatures (-40 to 105 °C) with a nominal voltage of 13.1 V, suitable for buffer or inverter-based applications requiring 0.01 A output current flow direction.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,389 parts In-Stock

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2,389

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Vyrian

USA . 1,811 parts In-Stock

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Distributors (Availability)

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Component Stockers USA

USA . 258 parts In-Stock

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$99.990

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258

$99.990

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Native Components

USA . 220 parts In-Stock

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$346.275

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$339.349

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$335.887

10k+ parts

$332.424

220

$346.275

$339.349

$335.887

$332.424

Northwest PG Solutions

USA . 1,454 parts In-Stock

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$380.902

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QUARKTWIN TECHNOLOGY LTD

USA . 24,896 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,118 parts In-Stock

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Microchip USA

USA . 5,594 parts In-Stock

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Kulean Microsystems

USA . 5,525 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,745 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Problanco Electronics

Mexico . 3,689 parts In-Stock

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SupplyDigital Components

Austria . 3,096 parts In-Stock

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Corphita

USA . 832 parts In-Stock

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TANS Electronics

Latvia . 775 parts In-Stock

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UHIMA Technologies

Türkiye . 586 parts In-Stock

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Corohmni

South Africa . 167 parts In-Stock

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167

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Overview

Discover the CS8191XNF16 by Onsemi, a top-of-the-line peripheral driver designed to deliver superior performance and reliability. With built-in protections against over current and over voltage, this product ensures the safety of your devices. From industrial applications to consumer electronics, this versatile component offers unparalleled value and benefits. Trust in Onsemi's reputation for quality and innovation, and elevate your projects with the CS8191XNF16 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the driver, ensuring a longer lifespan.

Maximum Supply Voltage: 16 V

The high maximum supply voltage allows for compatibility with a wide range of systems and applications.

Built-in Protections: OVER CURRENT; OVER VOLTAGE

The built-in protections help safeguard the driver and connected devices from potential damage due to over current or voltage spikes.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows the driver to operate effectively in various environments without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the driver can function even in extreme cold conditions.

Nominal Output Peak Current Limit: 0.01 A

The peak current limit ensures that the driver operates within safe parameters, protecting both the driver and connected devices.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The versatile interface IC type allows for flexibility in connecting the driver to various components and systems.

Output Current Flow Direction: SOURCE AND SINK

The ability to source and sink current makes the driver suitable for a wide range of applications, providing more flexibility and functionality.

Technical Specifications

Peripheral Drivers CS8191XNF16 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

OVER CURRENT; OVER VOLTAGE

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

19.175 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

.01 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

8/16

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

16 V

Minimum Supply Voltage:

8 V

Nominal Supply Voltage:

13.1 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

CS8191XNF16 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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