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CS-8191N16

Onsemi

CS-8191N16 by Onsemi

CS-8191N16 by Onsemi is a Peripheral Driver with 8/16V power supplies, 16 terminals, and industrial temperature grade. Its package style is in-line rectangular plastic/epoxy suitable for various applications requiring bipolar technology and tin/lead terminal finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,240 parts In-Stock

1+ parts

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2,240

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Vyrian

USA . 2,179 parts In-Stock

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2,179

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 316 parts In-Stock

1+ parts

$6.150

100+ parts

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316

$6.150

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SupplyDigital Components

Austria . 8,264 parts In-Stock

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8,264

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Problanco Electronics

Mexico . 8,106 parts In-Stock

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8,106

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TANS Electronics

Latvia . 7,100 parts In-Stock

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7,100

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Corphita

USA . 2,297 parts In-Stock

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2,297

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Northwest PG Solutions

USA . 730 parts In-Stock

1+ parts

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$6.027

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730

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$6.027

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Kulean Microsystems

USA . 582 parts In-Stock

1+ parts

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582

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UHIMA Technologies

Türkiye . 519 parts In-Stock

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519

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Corohmni

South Africa . 251 parts In-Stock

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251

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Overview

Maximize the performance of your peripheral devices with the CS-8191N16 by Onsemi. Designed with quality and reliability in mind, this product offers seamless integration and optimum functionality for a wide range of applications. With Onsemi's proven track record in manufacturing excellence, you can trust that this peripheral driver will deliver exceptional results every time. Whether you're looking to enhance your industrial automation systems or streamline your automotive electronics, the CS-8191N16 provides unparalleled value, benefits, and advantages that will exceed your expectations. Elevate your projects with Onsemi's cutting-edge technology and superior craftsmanship.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the peripheral driver, making it reliable for long-term use.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various electronic devices or systems, offering flexibility in design and installation.

Power Supplies (V): 8/16

Supports a range of power supply voltages (8V to 16V), making it compatible with different power sources and applications.

No. of Terminals: 16

High number of terminals provide connections for multiple input and output signals, allowing for comprehensive control and functionality.

Package Style (Meter): IN-LINE

In-line package style allows for easy connection in a linear fashion, optimizing space utilization and cable management in the setup.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliable performance in harsh environmental conditions or extended operation periods.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables the peripheral driver to function in cold environments without compromising its performance.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish offers good conductivity and solderability, ensuring secure connections and reliable signal transmission.

Terminal Position: DUAL

Dual terminal position allows for versatile installation and connectivity options, accommodating various wiring configurations and setups.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certifies that the peripheral driver can operate in demanding industrial environments with stability and durability.

Technology: BIPOLAR

Bipolar technology provides high precision and performance for the peripheral driver, delivering accurate signal processing and control capabilities.

Terminal Form: THROUGH-HOLE

Through-hole terminal form offers easy and secure soldering connections, enhancing the reliability and longevity of the peripheral driver.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54 mm allows for compatibility with common connector systems, facilitating easy integration and replacement in various setups.

Technical Specifications

Peripheral Drivers CS-8191N16 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

No. of Terminals:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

8/16

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

CS-8191N16 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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