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CS8190ENF16

Onsemi

CS8190ENF16 by Onsemi

CS8190ENF16 by Onsemi is a 16-terminal peripheral driver with a supply voltage range of 8.5V to 16V. It offers overvoltage protection and operates in industrial temperatures (-40 °C to 85°C). With source and sink current flow, it's ideal for buffer or inverter-based applications requiring a nominal output peak current limit of 0.01A.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,175 parts In-Stock

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Vyrian

USA . 745 parts In-Stock

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Infinite Electronics LLP

India . 200 parts In-Stock

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200

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Chip Stock

USA . 147 parts In-Stock

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LWI Electronics Inc

India . 41 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 33 parts In-Stock

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$0.393

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$0.377

33

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Northwest PG Solutions

USA . 376 parts In-Stock

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$0.432

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$0.381

376

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$0.381

Kulean Microsystems

USA . 7,963 parts In-Stock

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Infinite Electronics LLP (Excess)

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TANS Electronics

Latvia . 6,942 parts In-Stock

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SupplyDigital Components

Austria . 6,322 parts In-Stock

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Problanco Electronics

Mexico . 5,302 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

USA . 2,263 parts In-Stock

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UHIMA Technologies

Türkiye . 428 parts In-Stock

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Microchip USA

USA . 427 parts In-Stock

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Corohmni

South Africa . 179 parts In-Stock

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179

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Overview

Unlock the full potential of your electronic devices with the CS8190ENF16 by Onsemi. With a reputation for top-quality manufacturing, this peripheral driver offers unparalleled reliability and performance. From overvoltage protection to dual terminal positions, this product is designed to meet all your needs. Whether you're in the automotive industry or working on industrial applications, the CS8190ENF16 ensures seamless operation and peace of mind. Upgrade your projects today and experience the benefits of Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the product resistant to damage or wear over time.

Maximum Supply Voltage: 16 V

Supports a wide range of voltage inputs, ensuring flexibility and compatibility with various power sources.

Built-in Protections: OVER VOLTAGE

Ensures the safety of connected devices by preventing damage from excessive voltage levels.

Minimum Supply Voltage: 8.5 V

Allows the product to function effectively even with lower voltage inputs, enhancing its versatility.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures without compromising performance, suitable for industrial settings.

Terminal Finish: TIN LEAD

Provides reliable and secure connections, ensuring stable performance and signal transmission.

Nominal Output Peak Current Limit: 0.01 A

Controls the maximum current output to prevent overload and protect connected devices.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Offers versatile interface options for different types of peripherals, allowing for seamless integration.

Output Current Flow Direction: SOURCE AND SINK

Supports bidirectional current flow, enabling the product to handle a variety of applications effectively.

Technical Specifications

Peripheral Drivers CS8190ENF16 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

OVER VOLTAGE

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

19.175 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

.01 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Maximum Supply Voltage:

16 V

Minimum Supply Voltage:

8.5 V

Nominal Supply Voltage:

13.1 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

CS8190ENF16 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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