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CS8191XDWF20

Onsemi

CS8191XDWF20 by Onsemi

CS8191XDWF20 by Onsemi is a Peripheral Driver with 20 terminals, operating voltage range of 8-16V. It offers over current and over voltage protection, suitable for industrial applications requiring source and sink output current flow direction. The compact rectangular package measures 12.8mm x 7.5mm with a max seated height of 2.65mm, making it ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,443 parts In-Stock

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Vyrian

USA . 1,995 parts In-Stock

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1,995

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Distributors (Availability)

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Native Components

USA . 335 parts In-Stock

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$88.631

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$85.086

335

$88.631

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$85.086

Northwest PG Solutions

USA . 1,835 parts In-Stock

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$97.494

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$97.494

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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15,000

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QUARKTWIN TECHNOLOGY LTD

USA . 9,255 parts In-Stock

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Problanco Electronics

Mexico . 6,687 parts In-Stock

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TANS Electronics

Latvia . 6,561 parts In-Stock

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Kulean Microsystems

USA . 4,775 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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SupplyDigital Components

Austria . 3,588 parts In-Stock

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Microchip USA

USA . 2,831 parts In-Stock

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Corphita

USA . 2,409 parts In-Stock

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Corohmni

South Africa . 257 parts In-Stock

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UHIMA Technologies

Türkiye . 37 parts In-Stock

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Overview

Enhance your electronic designs with the CS8191XDWF20 by Onsemi, a top-of-the-line peripheral driver that promises unrivaled quality and reliability. Manufactured by trusted industry leader Onsemi, this product boasts built-in protections against over current and over voltage, ensuring the safety of your devices. With a wide range of applications in various industries, the CS8191XDWF20 offers customers exceptional value and benefits, including efficient power supplies, dual terminal positions, and a compact small outline package style. Elevate your projects with the superior performance and durability of the CS8191XDWF20 from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes this peripheral driver lightweight and durable, ideal for use in various applications.

Surface Mount: YES

The surface mount feature allows for easy installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 16 V

With a maximum supply voltage of 16V, this peripheral driver can handle higher voltage requirements, providing flexibility in design.

Built-in Protections: OVER CURRENT; OVER VOLTAGE

The built-in protections for over current and over voltage ensure the safety and reliability of connected devices, making this peripheral driver a secure choice.

Temperature Grade: INDUSTRIAL

The industrial temperature grade allows this peripheral driver to operate efficiently in a wide range of temperatures, making it suitable for industrial applications.

Nominal Output Peak Current Limit: 0.01 A

The nominal output peak current limit of 0.01A provides precise control over the current flow, ensuring the connected devices are protected from overloading.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter based interface IC type allows for seamless communication with other components, enhancing the overall performance of the system.

Output Current Flow Direction: SOURCE AND SINK

The ability to source and sink current allows this peripheral driver to drive various types of loads, providing versatility in applications.

Technical Specifications

Peripheral Drivers CS8191XDWF20 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

OVER CURRENT; OVER VOLTAGE

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

.01 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

8/16

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

16 V

Minimum Supply Voltage:

8 V

Nominal Supply Voltage:

13.1 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

CS8191XDWF20 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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