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CS-8191DW20

Onsemi

CS-8191DW20 by Onsemi

CS-8191DW20 by Onsemi is a 20-terminal peripheral driver with power supplies of 8/16V. Its industrial-grade technology, operating from -40 to 105 °C, makes it suitable for various applications requiring a small outline package and surface mount capability. The device features Gull Wing terminals with Tin/Lead finish in a rectangular plastic/epoxy body.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,165 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,165

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Vyrian

USA . 261 parts In-Stock

1+ parts

-

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1k+ parts

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10k+ parts

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261

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 159 parts In-Stock

1+ parts

$30.023

100+ parts

-

1k+ parts

-

10k+ parts

$28.822

159

$30.023

-

-

$28.822

Northwest PG Solutions

USA . 286 parts In-Stock

1+ parts

$33.025

100+ parts

-

1k+ parts

-

10k+ parts

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286

$33.025

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-

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TANS Electronics

Latvia . 7,854 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,854

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-

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SupplyDigital Components

Austria . 6,450 parts In-Stock

1+ parts

-

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6,450

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-

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Kulean Microsystems

USA . 3,596 parts In-Stock

1+ parts

-

100+ parts

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3,596

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Corphita

USA . 1,052 parts In-Stock

1+ parts

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1,052

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Corohmni

South Africa . 334 parts In-Stock

1+ parts

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100+ parts

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334

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Problanco Electronics

Mexico . 275 parts In-Stock

1+ parts

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100+ parts

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275

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UHIMA Technologies

Türkiye . 236 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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236

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Overview

Experience unparalleled quality and reliability with the CS-8191DW20 by Onsemi. As a leading manufacturer in the industry, Onsemi's Peripheral Drivers are known for their superior performance and durability. This versatile product is perfect for a wide range of applications, providing seamless integration and optimal functionality. With its innovative design and advanced technology, the CS-8191DW20 offers unmatched value and benefits to customers, making it the ideal choice for all your electronic needs. Upgrade to Onsemi today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components as it is lightweight, durable, and resistant to heat and chemicals.

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, making this product suitable for applications where space is limited.

Power Supplies (V): 8/16

The ability to operate on both 8V and 16V power supplies provides versatility for different applications and allows for compatibility with a range of systems.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105 °C, this product can withstand high temperatures, making it suitable for industrial environments where heat may be a factor.

Technology: BIPOLAR

Bipolar technology offers high switching speeds and low power consumption, making this product efficient and reliable for driving peripherals.

Technical Specifications

Peripheral Drivers CS-8191DW20 attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

No. of Terminals:

20

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

8/16

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

CS-8191DW20 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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