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AMIS30624C6245G

Onsemi

AMIS30624C6245G by Onsemi

AMIS30624C6245G by Onsemi is a Motion Control IC with 32 terminals, operating voltage of 8-29V. It features a max output current of 0.8A and operates in automotive temperature grade (-40 to 125°C). Ideal for stepper motor control applications due to its compact square package shape and surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,628 parts In-Stock

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VNN

France . 3,116 parts In-Stock

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Digiode

USA . 2,344 parts In-Stock

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Nova Conductors

Japan . 30 parts In-Stock

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Ampacity Inc.

Singapore . 1,249 parts In-Stock

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$5.500

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AZTECH Wire

Italy . 331 parts In-Stock

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$19.262

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Problanco Electronics

Mexico . 2,045 parts In-Stock

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Kulean Microsystems

USA . 1,375 parts In-Stock

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Microchip USA

USA . 395 parts In-Stock

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TANS Electronics

Latvia . 365 parts In-Stock

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SupplyDigital Components

Austria . 275 parts In-Stock

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Corohmni

South Africa . 244 parts In-Stock

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UHIMA Technologies

Türkiye . 236 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Corphita

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Overview

Experience precise and efficient motion control with the AMIS30624C6245G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products that meet the highest standards. Designed for a wide range of applications, this Motion Control IC offers unparalleled value and benefits to customers. With surface mount capabilities and a quad terminal position, this IC is perfect for automotive-grade environments. Trust Onsemi to provide you with reliable and innovative solutions for your motion control needs.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and efficient installation of the motion control IC onto a circuit board, saving time and effort during the manufacturing process.

Nominal Supply Voltage (Vsup): 12 V

Having a reasonable and standard supply voltage like 12V ensures compatibility with a wide range of systems, making this motion control IC versatile and easy to integrate.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles available cater to different space and heat dissipation requirements, allowing flexibility in design and application of the motion control IC.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this motion control IC can withstand harsh environmental conditions and maintain optimal performance in demanding applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the motion control IC can function reliably in cold environments without any performance issues.

Other IC type: STEPPER MOTOR CONTROLLER

Being a stepper motor controller, this motion control IC is suitable for precise and controlled motion applications, making it an ideal choice for robotics, automation, and CNC machines.

Maximum Output Current: 0.8 A

With a respectable maximum output current of 0.8A, this motion control IC can drive motors and actuators with sufficient power, ensuring smooth and accurate motion control.

Technical Specifications

Motion Control ICs AMIS30624C6245G attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO NEEDS 4.75V TO 5.5V VDD SUPPLY

Other IC type:

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

7 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.8 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,6.5/29

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Voltage (Vsup):

29 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width (mm):

7 mm

Trade Compliance

AMIS30624C6245G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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