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AMIS30623C6238RG

Onsemi

AMIS30623C6238RG by Onsemi

AMIS30623C6238RG by Onsemi is a Motion Control IC with 20 terminals, operating voltage of 6.5-29V, and output current of 0.8A. Ideal for stepper motor control applications due to its compact size (12.7762mm x 7.5mm) and dual terminal position design for precise motion control.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 3,383 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 426 parts In-Stock

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$16.820

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Native Components

USA . 419 parts In-Stock

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$59.653

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$57.267

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Northwest PG Solutions

USA . 1,066 parts In-Stock

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$65.618

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Perfect Parts

USA . 46,592 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 16,361 parts In-Stock

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RC Electronics

USA . 8,551 parts In-Stock

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TANS Electronics

Latvia . 8,394 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,451 parts In-Stock

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Problanco Electronics

Mexico . 7,019 parts In-Stock

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SupplyDigital Components

Austria . 5,203 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,967 parts In-Stock

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Kulean Microsystems

USA . 3,022 parts In-Stock

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Corphita

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Kepictronics

USA . 1,750 parts In-Stock

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Metaverse IC Inc.

Canada . 1,750 parts In-Stock

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Corohmni

South Africa . 342 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 43 parts In-Stock

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Overview

Experience unparalleled precision and reliability with the AMIS30623C6238RG by Onsemi, leading the way in motion control ICs. This compact yet powerful stepper motor controller offers seamless integration and exceptional performance for a wide range of applications. With Onsemi's reputation for quality and innovation, you can trust that this product will exceed your expectations. Unlock new possibilities and streamline your projects with the AMIS30623C6238RG, delivering unmatched value and efficiency to customers like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the IC, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the IC onto circuit boards, saving time and effort during production.

Nominal Supply Voltage (Vsup): 8 V

The nominal supply voltage of 8V ensures stable and reliable performance of the IC, making it suitable for a wide range of applications.

No. of Terminals: 20

Having 20 terminals provides flexibility in connecting the IC to other components and peripherals, allowing for a more versatile integration into different systems.

Maximum Output Current: 0.8 A

With a maximum output current of 0.8A, this IC is capable of driving high power motors and devices, making it ideal for motion control applications.

Technical Specifications

Motion Control ICs AMIS30623C6238RG attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO NEEDS 4.75V TO 5.5V VDD SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.7762 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

20

Maximum Output Current:

.8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,6.5/29

Qualification:

Not Qualified

Maximum Seated Height:

2.6416 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

10 mA

Maximum Supply Voltage (Vsup):

29 V

Minimum Supply Voltage (Vsup):

6.5 V

Nominal Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

AMIS30623C6238RG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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