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AMIS30622C6228RG

Onsemi

AMIS30622C6228RG by Onsemi

AMIS30622C6228RG by Onsemi is a Motion Control IC with 32 terminals, operating voltage of 6.5-29V, and max output current of 0.8A. Ideal for automotive applications due to its temp grade and compact square package shape with low seated height of 0.9mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,500 parts In-Stock

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7,500

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VNN

France . 927 parts In-Stock

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927

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Digiode

USA . 449 parts In-Stock

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449

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,252 parts In-Stock

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$5.500

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1,252

$5.500

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AZTECH Wire

Italy . 283 parts In-Stock

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$15.999

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283

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Component Stockers USA

USA . 760 parts In-Stock

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$99.990

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760

$99.990

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Problanco Electronics

Mexico . 7,812 parts In-Stock

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7,812

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SupplyDigital Components

Austria . 6,236 parts In-Stock

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TANS Electronics

Latvia . 5,250 parts In-Stock

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5,250

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Kulean Microsystems

USA . 1,543 parts In-Stock

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Corphita

USA . 876 parts In-Stock

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UHIMA Technologies

Türkiye . 393 parts In-Stock

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Corohmni

South Africa . 66 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Enhance your motion control systems with the AMIS30622C6228RG by Onsemi. Crafted with precision and expertise, this high-quality Motion Control IC offers unparalleled performance and reliability. Ideal for automotive applications, this product provides seamless integration and precise control. Elevate your projects with this surface mount IC that boasts a wide range of operational temperatures and impressive output current capabilities. Trust Onsemi for cutting-edge technology that delivers value and innovation to your designs. Experience the difference with the AMIS30622C6228RG.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and efficient installation on electronic circuit boards, making this product a convenient choice for assembly.

Package Shape: SQUARE

The square package shape helps in optimizing space utilization on the PCB, making it a good choice for compact designs.

Nominal Supply Voltage (Vsup): 8V

With a nominal supply voltage of 8V, this product is suitable for a wide range of applications while providing stable performance.

Power Supplies (V): 5,6.5/29

The multiple power supply options make this product versatile and compatible with various voltage requirements, making it a flexible choice for different projects.

No. of Terminals: 32

The high number of terminals allows for more connectivity options, making this product suitable for complex motion control applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles offered provide flexibility in design and heat dissipation, making this product a versatile choice for different environments.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand demanding conditions, making it a reliable choice for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that this product can function in cold environments, making it suitable for a wide range of settings.

Terminal Finish: TIN

The terminal finish of TIN ensures good solderability and conductivity, making this product a reliable choice for long-term use.

Terminal Position: QUAD

The quad terminal position allows for easier soldering and better electrical connections, making this product user-friendly and reliable.

Technical Specifications

Motion Control ICs AMIS30622C6228RG attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.8 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,6.5/29

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Voltage (Vsup):

29 V

Minimum Supply Voltage (Vsup):

6.5 V

Nominal Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

AMIS30622C6228RG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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