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AMIS30622C6228G

Onsemi

AMIS30622C6228G by Onsemi

AMIS30622C6228G by Onsemi is a Motion Control IC with 32 terminals, operating voltage of 6.5-29V, and max output current of 0.8A. Ideal for automotive applications due to its temp range of -40 to 125°C and compact square package style. Enables precise control in stepper motor systems with surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,426 parts In-Stock

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VNN

France . 3,157 parts In-Stock

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Digiode

USA . 1,437 parts In-Stock

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Chip Stock

USA . 195 parts In-Stock

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195

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Nova Conductors

Japan . 35 parts In-Stock

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35

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Ampacity Inc.

Singapore . 432 parts In-Stock

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$0.500

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432

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AZTECH Wire

Italy . 641 parts In-Stock

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$6.878

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641

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Kepictronics

USA . 4,820 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,246 parts In-Stock

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Kulean Microsystems

USA . 3,475 parts In-Stock

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TANS Electronics

Latvia . 3,250 parts In-Stock

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Problanco Electronics

Mexico . 2,994 parts In-Stock

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Corphita

USA . 1,992 parts In-Stock

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SupplyDigital Components

Austria . 1,393 parts In-Stock

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Bastille Electronics

Australia . 550 parts In-Stock

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UHIMA Technologies

Türkiye . 374 parts In-Stock

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Robosynatics

Brazil . 300 parts In-Stock

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300

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Lucentia Tech

USA . 300 parts In-Stock

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$1.684

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$1.559

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$1.559

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$1.559

Corohmni

South Africa . 111 parts In-Stock

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Overview

Revolutionize your motion control systems with the AMIS30622C6228G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products that are reliable and efficient. Designed for various applications, this Motion Control IC offers unparalleled value with its advanced features and capabilities. From robotics to automotive systems, this product ensures smooth and precise movement with ease. Upgrade your projects today with the AMIS30622C6228G and experience the benefits of superior performance and reliability.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy and efficient installation onto circuit boards, saving time and reducing production costs.

Package Shape: SQUARE

Square package shape provides a compact and space-efficient design, ideal for applications with limited board space or size constraints.

Nominal Supply Voltage (Vsup): 8 V

Optimal supply voltage ensures stable and reliable operation of the motion control IC.

Power Supplies (V): 5,6.5/29

Wide range of power supply options allows flexibility in different voltage input requirements, making it suitable for a variety of applications.

No. of Terminals: 32

High number of terminals provide connectivity options and signal routing capabilities for complex motion control functions.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Variety of package styles offer versatility in thermal management and space-saving solutions, catering to various application needs.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability and stability in harsh or demanding environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold or extreme conditions without compromising performance.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and solderability for reliable electrical connections.

Terminal Position: QUAD

Quad terminal position offers convenient alignment and soldering during installation onto circuit boards.

Maximum Seated Height: 0.9 mm

Low seated height allows for compact and slim designs, suitable for space-constrained applications.

Width (mm): 7 mm

Narrow width enables easy integration into small or tight spaces, enhancing overall design flexibility.

Other IC type: STEPPER MOTOR CONTROLLER

Stepper motor controller type indicates compatibility with stepper motors, making it ideal for precise and controlled motion applications.

Minimum Supply Voltage (Vsup): 6.5 V

Low minimum supply voltage ensures compatibility with a wide range of power sources, enhancing versatility in application design.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for reliable soldering during manufacturing processes, ensuring secure connections.

Length: 7 mm

Compact length contributes to overall small form factor and space-saving design for efficient board layout.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade indicates suitability for use in automotive applications, ensuring reliability in challenging temperature conditions.

Maximum Output Current: 0.8 A

High maximum output current capability enables driving of various loads, making it suitable for a wide range of motion control applications.

Terminal Form: NO LEAD

No lead terminal form complies with modern lead-free soldering requirements, promoting environmental sustainability.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting, enabling efficient use of board space and intricate circuit designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling procedures to maintain product integrity.

Maximum Supply Voltage (Vsup): 29 V

High maximum supply voltage accommodates a wide range of voltage input levels, providing flexibility in power source options.

Technical Specifications

Motion Control ICs AMIS30622C6228G attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.8 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,6.5/29

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Voltage (Vsup):

29 V

Minimum Supply Voltage (Vsup):

6.5 V

Nominal Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width (mm):

7 mm

Trade Compliance

AMIS30622C6228G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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