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7SB385MUTCG

Onsemi

7SB385MUTCG by Onsemi

7SB385MUTCG by Onsemi is a Bus Driver & Transceiver with 6 terminals, 0.25 ns propagation delay, and -55 to 125 °C operating temperature range. It is used in military-grade applications requiring small outline, very thin profile packages for inverted output polarity.

Median Price

$0.154

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 147,000 parts In-Stock

1+ parts

-

100+ parts

$0.160

1k+ parts

$0.133

10k+ parts

$0.118

147,000

-

$0.160

$0.133

$0.118

Verical

USA . 75,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$0.148

75,000

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-

-

$0.148

Distributors (In-Stock)

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Digiode

USA . 537 parts In-Stock

1+ parts

$0.131

100+ parts

-

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537

$0.131

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Vyrian

USA . 3,327 parts In-Stock

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3,327

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Distributors (Availability)

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Corohmni

South Africa . 252 parts In-Stock

1+ parts

$0.115

100+ parts

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252

$0.115

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Corphita

USA . 1,167 parts In-Stock

1+ parts

$0.124

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1,167

$0.124

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Native Components

USA . 565 parts In-Stock

1+ parts

$0.709

100+ parts

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565

$0.709

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Northwest PG Solutions

USA . 1,267 parts In-Stock

1+ parts

$0.779

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1,267

$0.779

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AZTECH Wire

Italy . 1,180 parts In-Stock

1+ parts

$19.210

100+ parts

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1,180

$19.210

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Continental Prestige Electronics

USA . 147,000 parts In-Stock

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$0.158

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147,000

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$0.158

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QUARKTWIN TECHNOLOGY LTD

USA . 19,238 parts In-Stock

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Kulean Microsystems

USA . 3,231 parts In-Stock

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3,231

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TANS Electronics

Latvia . 2,656 parts In-Stock

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2,656

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SupplyDigital Components

Austria . 2,122 parts In-Stock

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Problanco Electronics

Mexico . 1,671 parts In-Stock

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Microchip USA

USA . 330 parts In-Stock

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UHIMA Technologies

Türkiye . 160 parts In-Stock

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160

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Overview

Experience the superior quality and reliability of Onsemi with the 7SB385MUTCG, a top-of-the-line bus driver & transceiver designed for seamless communication in a compact package. Ideal for military-grade applications, this surface-mount device boasts fast propagation delay and inverted output polarity, ensuring optimal performance even in extreme temperatures. With a nominal supply voltage of 4.5V and dual terminal position, this product offers unmatched value and benefits to customers looking for a high-performing solution for their electronic needs. Trust Onsemi for cutting-edge technology that delivers results.

Feature Benefit Bullets

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly, saving time and effort in production.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and allows for easy integration into existing circuit designs.

Nominal Supply Voltage / Vsup (V): 4.5

The 4.5V nominal supply voltage ensures compatibility with a wide range of systems and power sources.

Propagation Delay (tpd): 0.25 ns

Low propagation delay ensures fast signal transmission, making this product ideal for high-speed applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance in a variety of environmental conditions.

Minimum Operating Temperature: -55 °C

Wide temperature range ensures functionality in both extreme hot and cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides corrosion resistance and high conductivity for long-term reliability.

No. of Ports: 2

Having 2 ports enables versatile connectivity options and allows for multiple data or signal transmissions.

Maximum Seated Height: 0.55 mm

Low seated height makes this product suitable for compact designs and space-constrained applications.

Output Polarity: INVERTED

Inverted output polarity can be useful for certain types of circuits and signal processing requirements.

Minimum Supply Voltage (Vsup): 4 V

Low minimum supply voltage ensures compatibility with lower power systems while still maintaining functionality.

Peak Reflow Temperature °C: 260

Withstanding high peak reflow temperatures ensures reliability during the soldering process.

Temperature Grade: MILITARY

Military-grade temperature rating indicates ruggedness and reliability for harsh operating environments.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high-density mounting and connection, ideal for space-saving designs.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage provides flexibility and compatibility with various power sources.

Technical Specifications

Bus Driver & Transceivers 7SB385MUTCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-XDSO-N6

JESD-609 Code:

e4

Length:

1.2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

7SB385MUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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