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7SB384AMX1TCG

Onsemi

7SB384AMX1TCG by Onsemi

7SB384AMX1TCG by Onsemi is a Bus Driver & Transceiver with 6 terminals, 0.25 ns propagation delay, and inverted output polarity. It operates in a temperature range of -55 to 125 °C and has a very thin profile package style. Ideal for military-grade applications requiring fast signal transmission.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,040 parts In-Stock

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Vyrian

USA . 780 parts In-Stock

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Northwest PG Solutions

USA . 938 parts In-Stock

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$3.275

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QUARKTWIN TECHNOLOGY LTD

USA . 9,057 parts In-Stock

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TANS Electronics

Latvia . 5,001 parts In-Stock

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Kulean Microsystems

USA . 4,914 parts In-Stock

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Problanco Electronics

Mexico . 2,557 parts In-Stock

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SupplyDigital Components

Austria . 2,241 parts In-Stock

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Corphita

USA . 1,677 parts In-Stock

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Native Components

USA . 440 parts In-Stock

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Microchip USA

USA . 357 parts In-Stock

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UHIMA Technologies

Türkiye . 139 parts In-Stock

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Corohmni

South Africa . 117 parts In-Stock

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Overview

Elevate your electronic designs with the 7SB384AMX1TCG by Onsemi. This innovative bus driver and transceiver offers unparalleled quality and reliability, thanks to Onsemi's reputation as a trusted manufacturer in the industry. Ideal for a wide range of applications, this product provides customers with unmatched value and benefits. Whether you're looking to enhance communication between devices or improve signal transmission, this product is the perfect solution. Upgrade your projects today with the 7SB384AMX1TCG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and facilitating automated assembly processes.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V ensures compatibility with a wide range of systems and power sources.

Propagation Delay (tpd): 0.25 ns

The low propagation delay of 0.25ns ensures fast and efficient signal transmission, making it suitable for high-speed communication applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, the product can withstand high temperature environments, ensuring reliability in various industrial settings.

Minimum Operating Temperature: -55 °C

The product's ability to operate at temperatures as low as -55 °C makes it suitable for use in cold or harsh environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures excellent conductivity and corrosion resistance, extending the product's lifespan and reliability.

No. of Ports: 2

Having 2 ports provides flexibility in connection options and allows for simultaneous data transmission, making it suitable for communication applications with multiple devices.

Minimum Supply Voltage (Vsup): 4 V

The minimum supply voltage of 4V ensures reliable operation even in low voltage conditions, providing consistent performance in varying power situations.

Technical Specifications

Bus Driver & Transceivers 7SB384AMX1TCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PBGA-B6

JESD-609 Code:

e4

Length:

1.45 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

1 mm

Trade Compliance

7SB384AMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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