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7SB3125AMX1TCG

Onsemi

7SB3125AMX1TCG by Onsemi

The Onsemi 7SB3125AMX1TCG is a Bus Driver & Transceiver with 6 terminals, operating voltage of 4-5.5V, and propagation delay of 0.25ns. Ideal for military applications due to its small outline package and wide temperature range from -55 to 125 °C.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 1,861 parts In-Stock

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Vyrian

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Native Components

USA . 883 parts In-Stock

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$29.390

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Northwest PG Solutions

USA . 667 parts In-Stock

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$29.096

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QUARKTWIN TECHNOLOGY LTD

USA . 21,214 parts In-Stock

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SupplyDigital Components

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TANS Electronics

Latvia . 4,991 parts In-Stock

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Microchip USA

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Problanco Electronics

Mexico . 4,448 parts In-Stock

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 780 parts In-Stock

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Corphita

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Corohmni

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Overview

Experience unparalleled quality and reliability with the 7SB3125AMX1TCG by Onsemi, a leading manufacturer in the industry. This bus driver & transceiver offers seamless surface mount installation and boasts a compact package shape for easy integration. With a nominal supply voltage of 4.5V and a wide temperature range, this product is ideal for military-grade applications. Trust Onsemi to deliver top-notch performance and efficiency, ensuring optimal results in your projects. Upgrade your systems today with the 7SB3125AMX1TCG and unlock a world of possibilities.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving time and cost in production processes.

Package Shape: RECTANGULAR

Rectangular package shape provides a standard form factor that is easy to integrate into existing designs or layouts.

Nominal Supply Voltage / Vsup (V): 4.5

Operating at a nominal supply voltage of 4.5V ensures compatibility with a wide range of systems and devices.

Propagation Delay (tpd): 0.25 ns

With a low propagation delay of 0.25 ns, this product offers fast and efficient signal transmission.

Maximum Operating Temperature: 125 °C

Capable of operating at temperatures up to 125 °C, making it suitable for a variety of environments and applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for reliable performance.

No. of Ports: 2

Having two ports allows for versatile connectivity options and potential for dual-channel communication.

Width: 1 mm

Compact width of 1mm enables space-saving integration in compact electronic devices or systems.

Output Polarity: INVERTED

Inverted output polarity can be beneficial for compatibility with specific devices or signal routing requirements.

Terminal Form: NO LEAD

No lead terminal form can assist in reducing the risk of soldering or assembly errors, improving overall product reliability.

Technical Specifications

Bus Driver & Transceivers 7SB3125AMX1TCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-XDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Power Supplies (V):

5

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

7SB3125AMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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